1. Introduction
Industrialists and researchers have diverted their focus towards miniaturization of electronic appliances over the last decade. Electronic appliances, such as smartphones, electronic gadgets, and control systems available in the market are expected to meet challenging consumer demands, wherein the hardware plays a role enabling complicated functions as effective interfaces and durable components [
1]. However, enhancing their reliability has remained an evolving challenge owing to the manufacturing processes [
2]. In addition to the printing and placement of components in the reflow soldering process, the heat source is considered as one of the crucial steps in the processes [
3]. An understanding of the thermal reflow profile is essential to control the soldering process and its process parameters, which will help in improving the performance of the solder, that is, it would be possible to influence the microstructure of the solder joint microstructure, increase the thickness of the intermetallic compound [
4] and improve the shear force it can sustain [
5].
Vapour phase soldering (VPS) is an established method of reflow soldering. The method utilizes the effect of heat transfer from the condensation phase. The prepared assembly of the board is immersed in the vapour space for condensation to take place [
6]. Illés et al. [
7] initially developed a model of this method and successfully investigated the effect on the solder assembly. The study found that the immersion of the board was able to alter the vapour space and control the shapes of the thermal profile of VPS. Another study by Illés et al. [
8] explored the method of using a low vapour pressure or concentration. It was observed that a low concentration could reduce the number of gas voids in the solder joints. Géczy et al. [
9] used an explicit model to imitate the VPS to resolve the issue of film-wise condensation heat transfer based on the Nusselt theory. Multiple case studies attempted to offer a practical approach to viewing the problem. However, most of the studies focused on the static condensate layer, which had low accuracy. Therefore, Illés et al. considered a dynamic condensate layer in the VPS process [
10]. The formation and motion of the layer and convective temperature transport effect were required for the dynamic approximation.
Another widely used but not often scientifically investigated method employed a radiation reflow oven. This method used the principle of heatwave transfer to heat the PCB assembly. The oven with a medium or long wave was generated by an infrared (IR) emitter panel or quartz heater that was placed on the top or bottom of the oven space [
11]. The existing literature on the heat transfer in the soldering process can be classified based on radiation and forced convection. Park et al. [
12] simulated the radiation using the discrete ordinates (DO) model to include the thermal radiation in the oven cavity. Meanwhile, Verboven et al. [
13] suggested the surface to surface (S2S) model to investigate the heat transfer in a pilot plant oven. Chhanwal et al. [
14] compared the previous two models with a discrete transfer radiation model (DTRM). Based on the diversity of the findings, tthe DO model was chosen to be compared with the experimental data throughout the study. Lau et al. [
15] claimed that the DO model was suitable for the case study with a localized heat source, such as using the IR. In regard to the numerical approach, the DO also poses the advantages of moderate computational cost in tetrahedral angular discretization with modest use of memory. Son and Sin [
16] initially proposed adding air (i.e., forced convection) into the soldering process through the porous panel heater to dampen the temperature fluctuations in the IR oven. However, the study was restricted to 2D model soldering processes. Verboven et al. [
17] expanded the work to analyse the 3D model in a combination of natural and forced convection regimes. The proposed regime, as suggested, was able to maintain the uniformity of heat transfer and reduction of moisture accumulated inside the oven. As highlighted by Khatir et al. [
18], the radiation was the predominant mode of heat transfer during lower velocities of airflow, and contrarily, at a higher velocity, the heat transfer was forced convection.
The FPCB is a promising technology as it is a soft feature film, flexible and lightweight. It is also referred to as an alternative to the rigid printed circuit board (RPCB) for electronic applications. The FPCB offers a potent of space-efficient design, enhances the inside system presence, and reduces weight and installation cost [
19,
20]. The FPCB is designed with different materials to carry unique properties that improve the thermal, chemical and mechanical properties. The most commonly used materials in the FPCB is plastic, which uses a medium-based mechanism to provide flexibility and mechanical integrity [
21]. Another possible material includes the group of polymer foils. Polyethylene naphthalate (PEN), polyester (PET), or polyimide (PI) are the most used polymer foils in the FPCB. These materials have different properties, such as a high Young’s modulus (E) and glass transition temperature (T
g), resulting in different design properties of the FPCB. For example, Gang et al. [
22] found that the T
g of the PEN, PET, and PI were 78,123, and 300 °C, respectively. So far, several electronic devices have adopted the coupling between RPCB and FPCB. For example, Yoon et al. [
23] applied the thermo-compression bonding method to bind these two boards. The authors had successfully determined the optimum bonding conditions, i.e., force, time, and temperature. Another study by Yoon et al. [
24], analysed the effect of the bonding method on joint reliability using a high-temperature storage test. For a temperature of 125 °C, the interfaces formed in PCB joints were observed to experience a change in the failure mode from a polyimide-electrode failure to brittle IMC failure. On the other hand, Lee et al. [
25] employed ultrasonic vibration to bind the electrodes. The electrodes were able to be bonded without any adhesive at a low temperature and time.
An in-depth understanding of the reflow oven with FPCB is required to facilitate the manufacturer to control the reflow profile during the soldering process. An associated study by Lau and Abdullah [
15] performed analytical research on the thermal effect and focused on the FR-4 material assembly using the DO model to study the heating behavior of the heating source. The study highlighted that PCB near edges and corners were the first to be heated. Another study by Lau et al. [
26] applied a grey-based Taguchi method to optimize the process. The Taguchi method determined the optimal parameters to be considered to reduce solder joint defects. Yamane et al. [
27] redesigned the hot air blowing unit of the oven by altering the layout of the hot air panel. The authors claimed that it could increase the heating ability wherein infrared and fan convection were used as the heating elements. This study can be regarded as the work continued after the optimization of the reflow oven process, as pioneered by Najib et al. [
28]. The authors successfully simulated the process for different reflow settings and were able to determine the overheat of the RPCB. The study, however, did not consider the FPCB and optimum positioning in the oven, which is of main interest in the current research.
This paper is devoted to formulating the numerical representation of the desktop reflow oven with the use of FPCB substrates subjected to the reflow soldering process. The operating temperature setting was set following JSTD 020E, as a concerning aspect before conducting the soldering process analysis. The RNG k-epsilon (RNGKE) and DO radiation models were used to model the airflow and radiation effect in the reflow process, respectively. The simulation data was then validated with the experimental temperature profile. The understanding of the oven chamber temperature and substrate thermal properties facilitated the control of thermal reflow profiling at a stationary position in the desktop oven.