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Journal: Metals, 2022
Volume: 12
Number: 1640

Article: Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy
Authors: by Jia Sun, Huaxin Liang, Shaofu Sun, Juntao Hu, Chunyu Teng, Lingyan Zhao and Hailong Bai
Link: https://www.mdpi.com/2075-4701/12/10/1640

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