Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Characterization and Analysis
2.3. Leaching Study
2.3.1. Leaching System
2.3.2. Parameter Effect Study
3. Results and Discussion
3.1. Characterization of MP-PCBs
3.2. Effect of Ultrasound
3.3. Effect of Ozone Dose
3.4. Effect of HCl Concentration
3.5. Effect of Solid/Liquid Ratio
3.6. Effect of Temperature
3.7. Effect of Reaction Time and Kinetics of the Leaching Process
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Element | Concentration |
---|---|
Cu | 27.56 ± 2.15% |
Fe | 3.24 ± 0.28% |
Al | 2.15 ± 0.16% |
Sn | 1.12 ± 0.07% |
Zn | 0.48 ± 0.03% |
Ag (mg/kg) | 972 ± 15.67 |
Au (mg/kg) | 156 ± 6.34 |
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Thi Hong Hoa, N.; Hoan, N.T.; Nguyen Trong, N.; Linh, N.T.N.; Quy, B.M.; Pham, T.T.H.; Nguyen, V.Q.; Nguyen Van, P.; Nguyen, V.D. Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals 2023, 13, 1145. https://doi.org/10.3390/met13061145
Thi Hong Hoa N, Hoan NT, Nguyen Trong N, Linh NTN, Quy BM, Pham TTH, Nguyen VQ, Nguyen Van P, Nguyen VD. Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals. 2023; 13(6):1145. https://doi.org/10.3390/met13061145
Chicago/Turabian StyleThi Hong Hoa, Nguyen, Nguyen To Hoan, Nghia Nguyen Trong, Nguyen Thi Ngoc Linh, Bui Minh Quy, Thi Thu Ha Pham, Van Que Nguyen, Phuoc Nguyen Van, and Vinh Dinh Nguyen. 2023. "Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach" Metals 13, no. 6: 1145. https://doi.org/10.3390/met13061145