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Volume 7
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10.3390/met7110478
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Article

Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification

by
Ulla Hauf
1,*,
Alexander Kauffmann
1,
Sandra Kauffmann-Weiss
2,
Alexander Feilbach
3,
Mike Boening
4,
Frank E. H. Mueller
4,
Volker Hinrichsen
3 and
Martin Heilmaier
1
1
Institute for Applied Materials (IAM-WK), Karlsruhe Institute of Technology (KIT), Engelbert-Arnold-Straße 4, 76131 Karlsruhe, Germany
2
Institute for Technical Physics (ITEP), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
3
High Voltage Laboratories (HST), Technische Universität Darmstadt, Fraunhoferstr. 4, 64283 Darmstadt, Germany
4
Plansee Powertech AG, Retterswil 13, 5703 Seon, Switzerland
*
Author to whom correspondence should be addressed.
Metals 2017, 7(11), 478; https://doi.org/10.3390/met7110478
Submission received: 5 October 2017 / Revised: 29 October 2017 / Accepted: 29 October 2017 / Published: 4 November 2017
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Abstract

The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructural regions that result from the heat, which is generated and dissipated during interruption. In the topmost region, local and global texture, as well as the resulting microstructure, indicate that both Cu and Cr were melted during rapid heating and solidification whereas in the region underneath, only Cu was melted and elongated Cu-grains solidified with the <001>-direction perpendicularly aligned to the surface. By analysing the lattice parameter of the Cu solid solution, a supersaturation of the solid solution with about 2.25 at % Cr was found independent if Cu was melted solely or together with the Cr. The according reduction of electrical conductivity in the topmost region subsequent to current interruption and the resulting heat distribution are discussed based on these experimental results.
Keywords: CuCr; supersaturation; solid solution; texture; powder metallurgy; microstructure; contact material; vacuum interrupter; heat affected volume CuCr; supersaturation; solid solution; texture; powder metallurgy; microstructure; contact material; vacuum interrupter; heat affected volume
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MDPI and ACS Style

Hauf, U.; Kauffmann, A.; Kauffmann-Weiss, S.; Feilbach, A.; Boening, M.; Mueller, F.E.H.; Hinrichsen, V.; Heilmaier, M. Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals 2017, 7, 478. https://doi.org/10.3390/met7110478

AMA Style

Hauf U, Kauffmann A, Kauffmann-Weiss S, Feilbach A, Boening M, Mueller FEH, Hinrichsen V, Heilmaier M. Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals. 2017; 7(11):478. https://doi.org/10.3390/met7110478

Chicago/Turabian Style

Hauf, Ulla, Alexander Kauffmann, Sandra Kauffmann-Weiss, Alexander Feilbach, Mike Boening, Frank E. H. Mueller, Volker Hinrichsen, and Martin Heilmaier. 2017. "Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification" Metals 7, no. 11: 478. https://doi.org/10.3390/met7110478

APA Style

Hauf, U., Kauffmann, A., Kauffmann-Weiss, S., Feilbach, A., Boening, M., Mueller, F. E. H., Hinrichsen, V., & Heilmaier, M. (2017). Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals, 7(11), 478. https://doi.org/10.3390/met7110478

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