Numerical Modeling and Analysis of Transient and Three-Dimensional Heat Transfer in 3D Printing via Fused-Deposition Modeling (FDM)
Round 1
Reviewer 1 Report
Comments and Suggestions for Authors(i) Equation 3, the term q/k is not in the discretized equation. Is it zero?
(ii) Equation 4b needs to be rechecked.
(iii) Page 8, line 15: time step is 0.005556 second
(iv) Fig. 3 is not required. Fig. 5 is sufficient
(v) Fig. 5(a,b), bed temperature is set to 60 C, but in contours it is not observed.
(vi) The total printing time is 37 seconds (as given on page 20). However, the first temperature peak in 10th layer appears after 170 seconds (in Figure 6) Similar confusion exists in other results.
(vii) Figure 8, the increase or coolant temperature from 10 to 40 C does not affect the cooling rate. This is against common observation. Same is for the effect of bed temperature in Fig. 9.
(viii) There is no difference seen in the results of zigzag and concentric pattern. This is unexpected.
Author Response
Please see the attachment.
Author Response File: Author Response.pdf
Reviewer 2 Report
Comments and Suggestions for Authors1.The introduction is not a list of existing research, please reorganize the introduction.
2.There are many literatures about this study, but the author only mentioned a few of them. Please continue to read and refer to relevant literatures.
3.The paper lacks a conclusion.
4.Please explain what software is used to realize the numerical simulation calculation.
Comments on the Quality of English Language1.The introduction is not a list of existing research, please reorganize the introduction.
2.There are many literatures about this study, but the author only mentioned a few of them. Please continue to read and refer to relevant literatures.
3.The paper lacks a conclusion.
4.Please explain what software is used to realize the numerical simulation calculation.
Author Response
Please see the attachment.
Author Response File: Author Response.pdf
Reviewer 3 Report
Comments and Suggestions for AuthorsThe paper focuses on the thermal analysis of the FDM 3D printing process. It involves the development of a simulation code using numerical discretization methods with an implicit scheme and an effective heat transfer coefficient for cooling. The paper validates the computational model with analytical solutions, showing over 99% agreement. It also examines interlayer and intralayer reheating effects, sensitivity to printing parameters, and the impact of different printing patterns on nodal temperatures.
The English level of the paper is proficient, effectively communicating complex technical content.
The methodology is robust, combining numerical simulations with theoretical analysis for a comprehensive understanding of the thermal dynamics in FDM 3D printing.
The paper could benefit from a more diverse range of case studies to validate the model.
A deeper discussion on the implications of these findings on the overall efficiency and quality of 3D printed parts would enhance the paper's practical relevance.
How does the choice of printing pattern affect the overall temperature distribution in the 3D printed object?
What are the implications of these findings for the mechanical properties of 3D printed materials?
How does the model handle different materials with varying thermal properties?
What are the limitations of the current simulation code in modeling complex geometries?
How could this research be extended to model other 3D printing technologies beyond FDM?
How does the effective heat transfer coefficient impact the accuracy of the model?
What are the challenges in scaling this model for larger or more intricate 3D printing applications?
How does the simulation account for environmental factors like ambient temperature and humidity?
Could this model be used to optimize the 3D printing process for specific applications, such as biomedical implants or aerospace components?
What future enhancements are planned for the simulation code to improve its versatility and accuracy?
Author Response
Please see the attachment.
Author Response File: Author Response.pdf