Order Article Reprints

Bae J-Y, Han M-H, Lee S-J, Kim E-S, Lee K, Lee G-s, Park J-H, Park J-G. Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate. Nanomaterials. 2022; 12(21):3893. https://doi.org/10.3390/nano12213893

Bae, Jae-Young, Man-Hyup Han, Seung-Jae Lee, Eun-Seong Kim, Kyungsik Lee, Gon-sub Lee, Jin-Hyung Park, and Jea-Gun Park. 2022. "Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate" Nanomaterials 12, no. 21: 3893. https://doi.org/10.3390/nano12213893

Bae, J.-Y., Han, M.-H., Lee, S.-J., Kim, E.-S., Lee, K., Lee, G.-s., Park, J.-H., & Park, J.-G. (2022). Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate. Nanomaterials, 12(21), 3893. https://doi.org/10.3390/nano12213893