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Journal: Nanomaterials, 2023
Volume: 13
Number: 2196

Article: Thermal Conductivity of 3C/4H-SiC Nanowires by Molecular Dynamics Simulation
Authors: by Kaili Yin, Liping Shi, Xiaoliang Ma, Yesheng Zhong, Mingwei Li and Xiaodong He
Link: https://www.mdpi.com/2079-4991/13/15/2196

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