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Journal: Nanomaterials, 2023
Volume: 13
Number: 2196
Article:
Thermal Conductivity of 3C/4H-SiC Nanowires by Molecular Dynamics Simulation
Authors:
by
Kaili Yin, Liping Shi, Xiaoliang Ma, Yesheng Zhong, Mingwei Li and Xiaodong He
Link:
https://www.mdpi.com/2079-4991/13/15/2196
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