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Nanomaterials
Volume 14
Issue 6
10.3390/nano14060487
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Article

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

by
Jianqiang Wang
1,2,3,
Jintao Wang
1,2,3,*,
Ziwen Lv
1,2,3,
Luobin Zhang
1,2,3,
Fengyi Wang
1,2,3,
Hongtao Chen
1,2,3,* and
Mingyu Li
1,2,3
1
Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
2
State Key Laboratory of Advanced Solder and Joining, Harbin Institute of Technology, Harbin 150001, China
3
Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
*
Authors to whom correspondence should be addressed.
Nanomaterials 2024, 14(6), 487; https://doi.org/10.3390/nano14060487
Submission received: 2 February 2024 / Revised: 1 March 2024 / Accepted: 6 March 2024 / Published: 8 March 2024
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Abstract

Nanoporous Cu foam is widely applied in many fields such as the packaging of electronic power devices. In this study, a sandwich-structured Cu-Zn eutectic alloy precursor composed of Cu0.53Zn0.47/Cu5Zn8/Cu0.53Zn0.47 is prepared through electroplating. The surface layer of the precursor, Cu0.53Zn0.47, has a flat surface with numerous grain boundaries, which effectively promotes its dealloying behavior. By contrast, Cu5Zn8 has a porous structure, which promotes the dealloying behavior at the center of the precursor. The dealloying of Cu0.53Zn0.47 is dominated by the coherent surface diffusion of Cu atoms, and the crystal lattice and orientation show no changes before and after dealloying. By contrast, the dealloying behavior of Cu5Zn8 requires the renucleation of Cu crystals; in this process, Cu atoms are transported to the surface of the layer by capillary forces to form clusters, which nucleate and grow.
Keywords: electroplating; etching; nanoporous copper; capillary force electroplating; etching; nanoporous copper; capillary force

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MDPI and ACS Style

Wang, J.; Wang, J.; Lv, Z.; Zhang, L.; Wang, F.; Chen, H.; Li, M. A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy. Nanomaterials 2024, 14, 487. https://doi.org/10.3390/nano14060487

AMA Style

Wang J, Wang J, Lv Z, Zhang L, Wang F, Chen H, Li M. A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy. Nanomaterials. 2024; 14(6):487. https://doi.org/10.3390/nano14060487

Chicago/Turabian Style

Wang, Jianqiang, Jintao Wang, Ziwen Lv, Luobin Zhang, Fengyi Wang, Hongtao Chen, and Mingyu Li. 2024. "A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy" Nanomaterials 14, no. 6: 487. https://doi.org/10.3390/nano14060487

APA Style

Wang, J., Wang, J., Lv, Z., Zhang, L., Wang, F., Chen, H., & Li, M. (2024). A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy. Nanomaterials, 14(6), 487. https://doi.org/10.3390/nano14060487

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