Peng, J.; Wang, X.; Wang, L.; Li, Y.; Liu, R.; Deng, S.; Guan, H.; Lu, H.
RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications. Photonics 2023, 10, 1348.
https://doi.org/10.3390/photonics10121348
AMA Style
Peng J, Wang X, Wang L, Li Y, Liu R, Deng S, Guan H, Lu H.
RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications. Photonics. 2023; 10(12):1348.
https://doi.org/10.3390/photonics10121348
Chicago/Turabian Style
Peng, Jiahao, Xiaofeng Wang, Libo Wang, Yang Li, Runhao Liu, Shiyao Deng, Heyuan Guan, and Huihui Lu.
2023. "RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications" Photonics 10, no. 12: 1348.
https://doi.org/10.3390/photonics10121348
APA Style
Peng, J., Wang, X., Wang, L., Li, Y., Liu, R., Deng, S., Guan, H., & Lu, H.
(2023). RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications. Photonics, 10(12), 1348.
https://doi.org/10.3390/photonics10121348
