A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards †
Abstract
1. Introduction
2. Materials and Methods
2.1. Solid Characterization and Pretreatment Leaching
2.2. Leaching of Copper
2.3. Extraction and Stripping of Copper
3. Results
3.1. Pretreatment Leaching
3.2. Leaching of Copper
- A total of 2 M H2SO4 as leaching agent;
- A total of 3 mL/g H2O2 (30% w/w) as oxidizing agent;
- An S/L ratio of 0.1 g/mL;
- Two stages;
- Residence time of 4 h;
- No agitation.
3.3. Extraction and Stripping of Copper
4. Conclusions
- The PCB metallic fraction, after the removal of the plastic material, is a remarkable copper resource as its copper content exceeds 20% and can be treated hydrometallurgically.
- More than 98% of copper was recovered from the dust by oxidative leaching in two stages, using 2 M H2SO4, 3 mL H2O2 (30% w/w)/g dust, and a solid/liquid ratio of 0.1 g/mL of dust.
- The optimum pH for the copper solvent extraction with ACORGA M5640 was 1.5.
- Copper was extracted quantitatively from the pregnant solution in two stages by ACORGA M5640 organic reagent at equilibrium pH 1.5 and an A/O ratio of 1:1.
- Copper was stripped off the loaded organic phase quantitatively in two stages by 2 M HCl and at an A/O ratio of 1:1.
- The concentration of copper in the stripped liquor was 7.4 g/L, with all other impurities being less than 0.2 mg/L, thus allowing copper electrowinning.
Funding
Acknowledgments
References
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| Metal | Initial Dust (% wt.) | Metallic Fraction after Separation (%wt.) | Solid Product after Pretreatment Leaching (%wt.) |
|---|---|---|---|
| Sn | 5.01 | 12.74 | 1.30 |
| Cu | 5.19 | 23.86 | 37.60 |
| Fe | 8.17 | 17.84 | 10.67 |
| Zn | 1.90 | 3.36 | 1.68 |
| Ni | 0.76 | 1.48 | 1.77 |
| Pb | 1.53 | 6.28 | 7.45 |
| Al | 3.18 | 3.29 | 1.04 |
| Total | 26.50 | 68.85 | 61.51 |
| H2SO4 Concentration | Cu Leaching Efficiency % |
|---|---|
| 1 M | 62.4 |
| 2 M | 66.0 |
| 4 M | 45.6 |
| Leaching Stage | Cu Recovery % |
|---|---|
| 1 | 34.4 |
| 2 | 63.7 |
| Total | 98.1 |
| Metal | Concentration before Purification (g/L) | Concentration after Purification (g/L) |
|---|---|---|
| Cu | 18.8 | 13.8 |
| Fe | 2.6 | 0.44 |
| Zn | 1.0 | 0.32 |
| Ni | 1.17 | 0.40 |
| pH | Cu (mg/L) | Fe (mg/L) | Zn (mg/L) | Ni (mg/L) |
|---|---|---|---|---|
| 1.5 | 1460 | 405 | 305 | 375 |
| HCl (M) | Cu (mg/L) | Fe (mg/L) | Zn (mg/L) | Ni (mg/L) |
|---|---|---|---|---|
| 2 | 7400 | 0.16 | 0.06 | 0.01 |
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Vlasopoulos, D.; Oustadakis, P.; Agatzini-Leonardou, S.; Tsakiridis, P.; Remoundaki, E. A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Mater. Proc. 2021, 5, 56. https://doi.org/10.3390/materproc2021005056
Vlasopoulos D, Oustadakis P, Agatzini-Leonardou S, Tsakiridis P, Remoundaki E. A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Materials Proceedings. 2021; 5(1):56. https://doi.org/10.3390/materproc2021005056
Chicago/Turabian StyleVlasopoulos, Dimitrios, Paschalis Oustadakis, Styliani Agatzini-Leonardou, Petros Tsakiridis, and Emmanouella Remoundaki. 2021. "A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards" Materials Proceedings 5, no. 1: 56. https://doi.org/10.3390/materproc2021005056
APA StyleVlasopoulos, D., Oustadakis, P., Agatzini-Leonardou, S., Tsakiridis, P., & Remoundaki, E. (2021). A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Materials Proceedings, 5(1), 56. https://doi.org/10.3390/materproc2021005056

