23 July 2021
Recruiting Editorial Board Members for the Section “Powder Metallurgy” of Metals

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Original Submission Date Received: .
The Section “Powder Metallurgy” of Metals is recruiting Editorial Board Members. You can check the existing Editorial Board Members by visiting the following link:
https://www.mdpi.com/journal/metals/sectioneditors/powder_metallurgy.
The main responsibilities of the Section Editorial Board Members are as follows:
This Section of Metals covers the field of powder metallurgy, focusing on a wider understanding of powder development, characterization, shaping, modeling, and powder metallurgy materials. Powder metallurgy allows for a better microstructural design and control, including the opportunities that the nanoscale field offers, allowing competition with other forming technologies in the development of high-performance materials for applications where extreme conditions can be expected. All metallic materials are considered, as well as metal matrix composites, hard metals, and tailored microstructural materials. Full-density materials, porous materials, and foams developed through specific routes of powder metallurgy are also considered.
The Section will cover any technology that can produce and tailor metallic powders (including atomizing, mechanical alloying, granulation or agglomeration techniques, chemical processes, etc.), conventional powder metallurgy technologies, such as press and sintering, special methods of assisted sintering (liquid phase sintering, microwave sintering, field assisted sintering), metal injection molding, and technologies that provide full-density materials (hot pressing, hot isostatic pressing, powder extrusion, sinter forging, etc.). Powder-based methods for developing materials by additive manufacturing will also be covered in the Section.
For more information about this Section and publishing in Metals, please see the Section’s webpage: https://www.mdpi.com/journal/metals/sections/powder_metallurgy.
To apply for this position, recommend potential candidates, or request further information, please contact Ms. Lyra Xing (lyra.xing@mdpi.com), the Section Managing Editor.