28 July 2022
Meet Us at the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE 2022), 26–29 August 2022, Chengdu, China


The 9th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies for Wireless Communications
(MAPE 2022) will be held from 26 to 29 August 2022, in Chengdu, China. MAPE 2022 is sponsored by the University of Electronic Science and Technology of China and Beijing Jiaotong University and is technically supported by the IEEE Antennas and Propagation Society. MAPE was initiated to celebrate the 20th anniversary of the foundation of IEEE Beijing Section in 2005. After several years, it has become the flagship wireless event of the IEEE Beijing Section, geared toward wireless communication industry professionals interested in the latest research and design.

This symposium will provide a multi-discipline forum allowing researchers and technologists in the fields of microwave, antenna, propagation, and EMC technologies to present new ideas and contributions in the form of technical papers and panel discussions on applications in the ever-growing area of wireless communications, such as 6G, NB-IoT, and LoRa.

Scope:

The topics of the symposium will cover all aspects of the theory and techniques of microwaves, antennas, propagation, and EMC necessary for wireless communications. Potential topics include, but are not limited to, the following:

  1. Systems and Services:
  • Mobile Satellite Communication;
  • WLANs;
  • Wireless Sensors and Ad Hoc Networks;
  • MIMO Technologies;
  • UWB and Impulse Radio;
  • Space—Time Channel Characterization and Modeling;
  • Terahertz Imaging and Sources;
  • Cyber Electromagnetics;
  • Internet of Things;
  • High-Power Microwave Systems.
  1. Microwave Electronics:
  • Passive and Active Circuits;
  • Power Amplifiers, Linearization, and Active Components;
  • MMICs and Microwave Circuits;
  • Microwave and Millimeter Wave ICs;
  • Millimeter Wave and Sub-Millmeter Wave Components;
  • Circuits and Systems.
  1. Antennas:
  • Microstrip and Printed Antennas;
  • Active and Integrated Antennas;
  • Array Antennas, Phased Arrays, and Feeding Circuits;
  • Mobile and Base Station Antennas;
  • Adaptive and Smart Antennas;
  • Ultra-Wideband, Broadband, and Multi-band Antennas;
  • Reconfigurable Antennas and Arrays;
  • Millimeter Wave and Sub-Millimeter Wave Antennas;
  • MEMS/Nanotechnology for Antennas.
  1. Propagation:
  • Mobile and Indoor Propagation;
  • Millimeter and Optical Wave Propagation;
  • Earth-Space and Terrestrial Propagation;
  • Ionospheric Propagation;
  • Propagation and Channel Characterization;
  • Diversity Techniques and Fading Countermeasures;
  • Signal Separation and Interference Rejection;
  • Random Media and Rough Surfaces.
  1. Electromagnetics:
  • Electromagnetic Theory;
  • Complex Media and Artificial Media;
  • Computational Electromagnetics;
  • Biomedical Application of Electromagnetic Waves;
  • EM-Plasma Interaction;
  • Space–Time Modulated Electromagnetics.
  1. EMC Technologies:
  • EMC Sources: Electromagnetic Environment, Lightning, Intentional EMI and EMP, High Power Electromagnetics, ESD, and UWB;
  • EMC of Components and Integrated Circuits, PCB, Electronic Packaging and Integration;
  • EMC in Power Systems and Power Quality;
  • System Level EMC;
  • EMC in Power Electronics;
  • EMC in Smart Grids;
  • EMC in Internet of Things;
  • EMC in Communications: Wired and Wireless Communications, 6G, UWB, and Power Line Communications;
  • EMC Standards, Management, and Regulations;
  • EMC in Aerospace.

For further information, please refer to the conference website, or contact us via [email protected].

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