Reprint

Thermal and Electro-thermal System Simulation

Edited by
November 2019
222 pages
  • ISBN978-3-03921-736-6 (Paperback)
  • ISBN978-3-03921-737-3 (PDF)

This book is a reprint of the Special Issue Thermal and Electro-thermal System Simulation that was published in

Chemistry & Materials Science
Engineering
Environmental & Earth Sciences
Physical Sciences
Summary
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Format
  • Paperback
License
© 2019 by the authors; CC BY licence
Keywords
thermal conductivity; niobium pentoxide; structure function; time domain thermoreflectance; thin film; electronic packages; JEDEC metrics; model-order reduction; thermal simulation; LED; compact thermal model; boundary condition independent; LED compact thermal models; heating and optical power; Cauer RC ladder; dynamic thermal compact model; LED; silicone dome; phosphor light conversion; structure function; thermal transient analysis; thermal characterization; multiple heat source; secondary heat path; power semiconductor devices; IGBT; modelling; transient analysis; SPICE; switching; thermal phenomena; light emitting diodes; power LEDs; multi-domain modelling; LED luminaire design; DC–DC converters; ferromagnetic cores; modeling; power losses; thermal management; carbon nanotubes; thermal interface material; reliability; thermal aging; LED digital twin; design flow; multi-domain compact model; tool agnostic; multi-LED; thermal transient testing; non-destructive testing; thermal testability; in-situ characterization; electric aircraft; motor cooling; thermal management