Electronic Structure and Transport Properties of Two-Dimensional Materials

Dear Colleagues,

Two-dimensional materials, compared to bulk materials, offer unique and advanced electronic, magnetic, optical, and catalytic properties, along with quantum effects, due to their atomic thickness, enabling greater flexibility, miniaturization, and technological integration. In light of these advancements, Nanomaterials is pleased to announce and invite submissions for a Special Issue titled “Electronic Structure and Transport Properties of Two-Dimensional Materials”. This Special Issue aims to highlight the recent progress and address the key challenges in understanding the relationship between atomic structure, electronic structure, and transport properties in 2D materials. We welcome contributions on the current trends in this field, including but not limited to the following topics:

1. Heterostructures: stacking and twisting different 2D materials to tailor new advanced properties.
2. Dopants and Defect Management: impact of dopants or defects on electronic and transport behaviors, along with innovative strategies for defect control.
3. Strain Engineering: effects of mechanical strain on the electronic and transport properties of 2D materials.
4. Spintronic Applications: spin-dependent properties of 2D materials and their use in spintronic devices.
5. Advanced 2D Material Fabrication: techniques for synthesizing and fabricating new 2D materials with controlled properties, including methods for large-scale production.
6. Topological Phases: exploring exotic quantum states for quantum computing.
7. 2D Material Integration: challenges and solutions for integrating 2D materials into practical devices and systems.
8. Thermoelectric Applications: enhancements in thermoelectric properties and their applications in energy conversion and management.
9. Energy Applications: utilizing 2D materials in energy storage and conversion technologies, like batteries and fuel cells.
10. Computational and Theoretical Studies: advances in modeling and simulations to predict and understand the behavior of 2D materials.
11. Understanding Fundamental Mechanisms: elucidating the principles governing the electronic and transport properties of 2D materials.
12. Machine Learning for Discovery: using machine learning to predict and optimize new 2D materials and their properties.

Dr. Xiao Tong
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Nanomaterials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2900 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• 2D materials and heterostructures
• electronic structure
• electronic transport
• TMDs
• van der Waals stacking
• topological insulators
• spintronic
• magnetic
• monolayers
• strain and defect engineering
• STM
• ARPES