Advanced Flexible Electronics for Sensing Application
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Nanosensors".
Deadline for manuscript submissions: 25 January 2025 | Viewed by 47
Special Issue Editor
Special Issue Information
Dear Colleagues,
This Special Issue focuses on the latest advances in flexible electronics and their promising applications in various sensing technologies. Flexible electronics, based on functional materials like polymers, hydrogels, and 2D, carbon, and nanomaterials, can be fabricated into fibers or thin films, which enable new capabilities beyond those of traditional rigid electronics.
The papers included in this SI cover frontier research on flexible materials (e.g., sensor materials, flexible substrates, conductive electrodes, etc.), devices, fabrication methods, and system integration strategies for sensing applications. The key topics span flexible sensors for monitoring physical parameters (light, temperature, strain, pressure, etc.), chemical/biomedical sensing, self-powered sensing, in-memory sensor computing, and multimodal sensing for human-machine interfaces. Prominent examples are wearable sensors for imagers, neuromorphic electronics, healthcare, robotics, Internet of Things, and smart environments.
The inherent flexibility, light weight, conformability, and potential for low-cost manufacturing make flexible electronics extremely attractive for next-generation sensing solutions. However, scientific and engineering challenges remain in improving their performance, reliability, scalability, and integration levels. This Issue aims to capture the state-of-the-art in this rapidly evolving interdisciplinary field and identify future research directions.
The contributed works provide a comprehensive overview, ranging from fundamental innovations in flexible materials and devices to system-level implementations across diverse sensing applications, offering valuable insights for researchers in advanced flexible integrated devices and systems.
Dr. Xinkai Xie
Guest Editor
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible electronics
- wearable sensors
- self-powered optoelectronics
- multimodal sensors
- neuromorphic sensors
- e-textiles
