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Advances in Signal Processing and Sensing Technology for Improved Structural Health Monitoring

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 20 April 2025

Special Issue Editors


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Guest Editor
Materials Physics and Applications (MPA), Los Alamos National Laboratory, Los Alamos, NM 87545, USA
Interests: Structural health monitoring; Acoustic non-destructive evaluation; Machine learning; Prognosis; signal processing.

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Guest Editor
Materials Physics and Applications (MPA), Los Alamos National Laboratory, Los Alamos, NM 87545, USA
Interests: Structural health monitoring; Acoustic metamaterial; Acoustic non-destructive evaluation; High temperature acoustics; Sensor technology.

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Guest Editor
Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI 48824, USA
Interests: Non-destructive evaluation; Ultrasonics; Structural Health Monitoring; Guided Waves; Measurements and Instrumentation; FE modeling; Microcontrollers; Composite Structures.
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Special Issue Information

Dear Colleagues,

Structural health monitoring and non-destructive evaluation are vital tools for ensuring the operational safety of our infrastructure and various industrial process. With recent advancements in machine learning and sensing technology, structural health monitoring tools are expected to become more accurate, rapid and capable of damage diagnosis than before.

This Special Issue requests the submission of both review and original research articles related to the advancement of signal processing and sensing technology for improved structural health monitoring. Topics include but are not limited to the following:

  • Machine learning for feature extraction, imaging, signal processing, data fusion, and rapid damage diagnostics;
  • Sensing techniques such as phased array sensors, multi-sensor, etc.;
  • Damage diagnosis and prognosis using non-destructive evaluation;
  • Machine learning-assisted structural health monitoring;
  • Inspection of complex structures;
  • Damage imaging using advanced sensing techniques;
  • Multi sensor data fusion.

Dr. Rajendra Prasath Palanisamy
Dr. Alp Tugrul Findikoǧlu
Dr. Oleksii Karpenko
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • • Acoustic sensing
  • • Defect imaging
  • • Thermal imaging
  • • Sensor development
  • • Machine learning
  • • Signal processing
  • • Non-destructive testing
  • • Composite inspection
  • • Material characterization
  • • Real-time monitoring
  • • Digital twin
  • • Training data scarcity.

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Published Papers

This special issue is now open for submission.
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