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Advances in Printed Sensors and Electronics: Research and Applications

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (25 March 2024) | Viewed by 194

Special Issue Editor


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Guest Editor
School of Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR 97331, USA
Interests: printed and flexible hybrid electronics (print modalities; novel ink synthesis/characterization; devices); silicon photonics (modeling; interconnects; devices; hybrid integration with novel materials; packaging); fiber optics (modeling; sensors development and characterization); 2D optoelectronics.
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Printed sensors and electronics are recognized as promising research areas that can complement (and in some cases replace) traditional silicon-based electronics due to the ability to fabricate devices directly on flexible substrates using high-throughput processes. The interest in printed electronics is progressively increasing in the context of next-generation electronics, such as flexible displays, wearable computers, and the Internet of Things. For the successful realization of applications, lower-temperature, easier-to-fabricate, less time-consuming, and more cost-effective approaches are considered, and various printing techniques with organic, inorganic, and bio-inspired materials have been developed and analyzed for practical device applications. In order to ensure a successful approach to the potentially large market that will be created by printed electronics, more effective research is required, with comprehensive studies on materials, printing processes, and the demonstration of electronic devices.

In this Special Issue on Printed Sensors and Electronics, potential topics could include, but are not limited to, original research work on recent developments in materials, processing, and applications. Examples include printed thin-film transistors, photovoltaics, displays, sensors, batteries, wearable devices, and flexible hybrid electronics.

Dr. Harish Subbaraman
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers

There is no accepted submissions to this special issue at this moment.
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