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Keywords = heat transferenhancement

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17 pages, 6299 KB  
Article
Numerical Study of Thermal and Resistance Characteristics in the Vortex-Enhanced Tube
by Yiang Li, Wenzhi Cui, Xuefeng Jiang, Longjian Li and Juanfang Liu
Energies 2025, 18(1), 13; https://doi.org/10.3390/en18010013 - 24 Dec 2024
Cited by 1 | Viewed by 962
Abstract
Heat transfer enhancement is always pursued in the industry to achieve high-performance and low-energy-consumption heat exchange devices and systems. For decades, various types of heat transfer-enhancing tubes with differing geometries and wall configurations have been developed. In this paper, the heat transfer and [...] Read more.
Heat transfer enhancement is always pursued in the industry to achieve high-performance and low-energy-consumption heat exchange devices and systems. For decades, various types of heat transfer-enhancing tubes with differing geometries and wall configurations have been developed. In this paper, the heat transfer and pressure drop characteristics of air inside an innovative heat transfer tube with regular wall dimples, namely a vortex-enhanced tube, which has a great application prospect in the gas–gas heat exchanger, are numerically studied with an experimentally validated model. The effects of the depth, axial pitch, and radial rotation angle of the dimple in the tube wall on the convective heat transfer coefficient and friction drag coefficient are comprehensively analyzed. Based on the Performance Evaluation Criteria (PEC) of the tubes, the optimal parameters of the vortex-enhanced tube are obtained. When Re ranges from 10,000 to 40,000, the comprehensive evaluation factor of the vortex-enhanced tube is 1.29 times higher than the smooth tube. Dimple pacing, dimple depth, and dimple helical angle of the optimal tube type are 8 mm, 6 mm, and 83°, respectively. Full article
(This article belongs to the Collection Advances in Heat Transfer Enhancement)
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40 pages, 11084 KB  
Review
Advanced Study of Spray Cooling: From Theories to Applications
by Tianshi Zhang, Ziming Mo, Xiaoyu Xu, Xiaoyan Liu, Haopeng Chen, Zhiwu Han, Yuying Yan and Yingai Jin
Energies 2022, 15(23), 9219; https://doi.org/10.3390/en15239219 - 5 Dec 2022
Cited by 48 | Viewed by 8814
Abstract
With the continuous integration and miniaturization of electronic devices, the heat transfer of the electronic devices continues to surge. This means that thermal management equipment with higher heat flux cooling capacity is required to maintain its normal operation. This paper systematically reviews the [...] Read more.
With the continuous integration and miniaturization of electronic devices, the heat transfer of the electronic devices continues to surge. This means that thermal management equipment with higher heat flux cooling capacity is required to maintain its normal operation. This paper systematically reviews the progress of spray cooling. In the first part, the thermal dissipation mechanism of spray cooling in the non-boiling regime and boiling regime are summarized, and the correlation formula of heat transfer is summarized. In the second part, the influencing factors of various parameters of the nozzle are summarized, the experimental research and numerical simulation research are summarized separately, and some means and methods to strengthen heat transfer are listed. In the third part, we summarize the current application research of spray cooling in some hot new fields, including electronic technology, aerospace, biomedicine, battery safety, etc. The research prospects and challenges in these fields are highlighted. This research provides a timely and necessary study of spray cooling. Full article
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