Advances in Integrated Photonics

Dear Colleagues,

In recent decades, integrated photonics research has made significant progress in terms of materials, physical mechanisms, and fabrication techniques. By merging photonics, electronics, and mechanics into a single waveguide chip, integrated photonics offers exceptional efficiency, performance and scalability, making it a compelling alternative to conventional discrete devices across various applications.

Silicon photonics has received considerable attention due to its high integration density and compatibility with CMOS processes. Additionally, other material platforms including III-V compounds, silicon nitride, and thin film lithium niobate have gained traction due to their exceptional material properties such as ultra-low loss, high carrier mobility, and large electro-optic and nonlinear coefficients.

Heterogeneous integration of multiple materials enables the assembly of light sources, modulators, routers, detectors and other devices on a single substrate, addressing system-on-chip requirements. Integrated photonics extends beyond traditional optical communication and information processing, offering immense potential in optical computing, medical imaging, LiDAR, sensing, spectral analysis, microwave photonics, biophotonics and optical quantum technology. The integration of diverse materials and functionalities paves the way for groundbreaking optical systems that will shape future technologies.

This Special Issue aims to highlight the advancements in integrated photonics. Authors are encouraged to submit their research papers focusing on innovative developments and breakthroughs in this striking field. Topics of interest include, but are not limited to, the following:

• Integrated optical passive devices and active devices;
• Integrated optical nonlinear devices;
• Heterogeneous integration;
• Integrated optical communication devices;
• Integrated optical sensors;
• Biophotonic chips;
• Optical quantum chips;
• Optical logic chips;
• Microwave photonic chips.

Dr. Zhefeng Hu
Dr. Weike Zhao
Dr. Mengruo Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• integrated optical passive devices and active devices
• integrated optical nonlinear devices
• heterogeneous integration