Announcements

10 August 2026
Designs Travel Award—Open for Applications


We are pleased to announce that the application period for the Designs (ISSN 2411-9660) Travel Award is now open. The applications will be assessed by an Evaluation Committee consisting of senior scholars from the Designs Editorial Board.

This prize offers financial support for the winner to attend an international conference covering all areas of engineering designs of disciplines and industrial applications, which will be held in 2027, in order to hold a presentation, present a poster, or both.

Candidate requirements:

  • Postdoctoral fellows or PhD students;
  • Plans to attend an international conference in 2027 (oral presentation or poster).

List of documents for application:

  • Information of the conference the applicant is planning to attend and the abstract that will be submitted;
  • Curriculum vitae and list of publications;
  • Justification letter describing the focus of the research (max. 800 words);
  • Letter of recommendation from the supervisor, research director, or department head, which also confirms the applicant’s status.

The winner (one awardee) will be awarded CHF 800 and an electronic certificate. Please submit your application for the Designs Travel Award through the following link: https://www.mdpi.com/journal/designs/awards/4034 (by clicking on “Apply”).

The application deadline is 31 December 2026. The winner will be announced on the Designs website at the end of February 2027, and the prize will be awarded at the same time. If you have any questions about this award and the application, please feel free to write to the Editorial Office at designs@mdpi.com.

Designs Editorial Office

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