Advances in Brazing and Solder Joint in Microelectronic Packaging

Dear Colleagues,

Advanced electronic devices are essential in every aspect of our life today. One of the main processes in joining electronic components into a functional circuit is soldering. In addition, the solder alloys used during the soldering process are continuously improved to meet the needs of advanced electronic devices. Microelectronic packaging technology has recently seen progress towards miniaturization, high density, multifunction, and high speed. With the growing complexity and functionality of integrated circuits in electronic devices, solder joints should be reliable during soldering and service. In the soldering process, formation of intermetallic compounds (IMCs) is a necessary condition for the formation of solder joints. The reliability of solder joints depends strongly on the formation and growth of IMCs at the interface. With the growth of IMCs at the interface, stress concentration tends to form that leads to cracks and reduces the reliability of solder joints.

Conventional Sn–Pb solder alloys are widely used in electronic packaging due to their outstanding properties and performances. The toxicity of Pb in solder alloys jeopardizes human health and the environment, and thus, the use of Pb has been prohibited. Therefore, a large number of lead-free solder alloys have been introduced. However, to meet demands in advanced electronic packaging, it is necessary to improve the performance of lead-free solder alloys.

The purpose of this Special issue is to compile works related to the development of alloys for soldering and brazing of advanced microelectronic packaging.

Dr. Mohd Arif Anuar Mohd Salleh
Dr. Mohd Sharizal Abdul Aziz
Dr. Dewi Suriyani Che Halin
Guest Editors

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• soldering
• brazing
• microelectronic packaging materials
• lead-free solder
• solder joint
• solder alloy
• solidification