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Integrated Sensor Arrays and Array Signal Processing

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A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 October 2016) | Viewed by 35135

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Special Issue Editors

Dr. Andrew J. Mason

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Guest Editor

Department of Electrical and Computer Engineering Michigan State University East Lansing, MI 48824-2252 USA
Interests: wearable/implantable biosensor and chemical sensor systems for biomedical and environmental monitoring applications; low-power mixed-signal integrated circuits; microfabricated electrochemical sensor arrays; energy efficient signal processing algorithms and hardware for neural implants and sensor arrays; post-CMOS integration of sensing, instrumentation, and microfluidics; Technology for sustainable living
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Dr. Haitao Li

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Maxim Integrated Products, Inc., San Jose, CA

Dr. Yuning Yang

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Guest Editor

Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA

Special Issue Information

Dear Colleagues,

Integrated sensor arrays capable of measuring multiple analytes in a compact and low power hardware platform are of growing importance in many fields, including environment monitoring, biological science, medical diagnostics, clinical therapy, and personal healthcare. Sensing techniques in integrated sensor arrays include optical, electrochemical, magnetic, resistive, and capacitive methods. As sensing technologies advance, many open challenges remain in the development of integrated senor arrays that are both miniaturized and high performance in terms of sensitivity, selectivity, power, reliability, etc. Because these challenges impact many fields of research, collectively sharing new design concepts and technological approaches in the areas of transducers, electronics and array signal processing algorithms can be of great benefit. Therefore, the aim of this Special Issue is to bring together state-of-the-art research contributions that address challenges in integrated sensor arrays and array signal processing. Topics of primary interest include, but are not limited to, integrated sensor arrays for transducing biological, chemical or physical phenomena into electrical signals; sensor array interface/readout electronics that enable high sensitivity, low noise, high density, low power consumption, low crosstalk and other performance factors; and computationally efficient sensor array algorithms for pattern recognition, sensor fusion, calibration and improving system performance using data from arrays of sensors.

For this Special Issue, we solicit review articles, original research papers, and short communications covering all aspects of integrated sensor arrays and array signal processing, including: miniaturized transducer arrays, electronics for sensor arrays, such as analog front end, physical-to-digital convertors and telemetry circuits, and array signal processing algorithms. Contributions must show innovation in at least one of the sensor array component areas of transducers, electronics or algorithms. Sensor array system integration without innovations in one of these three sensor array components will not be considered. Submissions should clearly indicate which open challenges in integrated sensor arrays and array signal processing the work is addressing. Authors are invited to contact the Guest Editors prior to submission if they are uncertain whether their work falls within the general scope of this Special Issue.

Prof. Dr. Andrew J. Mason
Dr. Haitao Li
Dr. Yuning Yang
Guest Editors

Manuscript Submission Information

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Keywords

Integrated sensor arrays
sensor array algorithm
biosensor
CMOS

Published Papers (6 papers)

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Research

989 KiB

Open AccessArticle

Design of an Acoustic Target Intrusion Detection System Based on Small-Aperture Microphone Array

by Xingshui Zu, Feng Guo, Jingchang Huang, Qin Zhao, Huawei Liu, Baoqing Li and Xiaobing Yuan

Sensors 2017, 17(3), 514; https://doi.org/10.3390/s17030514 - 04 Mar 2017

Cited by 18 | Viewed by 5794

Abstract

Automated surveillance of remote locations in a wireless sensor network is dominated by the detection algorithm because actual intrusions in such locations are a rare event. Therefore, a detection method with low power consumption is crucial for persistent surveillance to ensure longevity of the sensor networks. A simple and effective two-stage algorithm composed of energy detector (ED) and delay detector (DD) with all its operations in time-domain using small-aperture microphone array (SAMA) is proposed. The algorithm analyzes the quite different velocities between wind noise and sound waves to improve the detection capability of ED in the surveillance area. Experiments in four different fields with three types of vehicles show that the algorithm is robust to wind noise and the probability of detection and false alarm are 96.67% and 2.857%, respectively. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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4551 KiB

Open AccessArticle

Robust Functionalization of Large Microelectrode Arrays by Using Pulsed Potentiostatic Deposition

by Joerg Rothe, Olivier Frey, Rajtarun Madangopal, Jenna Rickus and Andreas Hierlemann

Sensors 2017, 17(1), 22; https://doi.org/10.3390/s17010022 - 23 Dec 2016

Cited by 5 | Viewed by 6191

Abstract

Surface modification of microelectrodes is a central step in the development of microsensors and microsensor arrays. Here, we present an electrodeposition scheme based on voltage pulses. Key features of this method are uniformity in the deposited electrode coatings, flexibility in the overall deposition area, i.e., the sizes and number of the electrodes to be coated, and precise control of the surface texture. Deposition and characterization of four different materials are demonstrated, including layers of high-surface-area platinum, gold, conducting polymer poly(ethylenedioxythiophene), also known as PEDOT, and the non-conducting polymer poly(phenylenediamine), also known as PPD. The depositions were conducted using a fully integrated complementary metal-oxide-semiconductor (CMOS) chip with an array of 1024 microelectrodes. The pulsed potentiostatic deposition scheme is particularly suitable for functionalization of individual electrodes or electrode subsets of large integrated microelectrode arrays: the required deposition waveforms are readily available in an integrated system, the same deposition parameters can be used to functionalize the surface of either single electrodes or large arrays of thousands of electrodes, and the deposition method proved to be robust and reproducible for all materials tested. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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815 KiB

Open AccessArticle

Acoustical Direction Finding with Time-Modulated Arrays

by Ben Clark and James A. Flint

Sensors 2016, 16(12), 2107; https://doi.org/10.3390/s16122107 - 11 Dec 2016

Cited by 13 | Viewed by 5879

Abstract

Time-Modulated Linear Arrays (TMLAs) offer useful efficiency savings over conventional phased arrays when applied in parameter estimation applications. The present paper considers the application of TMLAs to acoustic systems and proposes an algorithm for efficiently deriving the arrival angle of a signal. The proposed technique is applied in the frequency domain, where the signal and harmonic content is captured. Using a weighted average method on harmonic amplitudes and their respective main beam angles, it is possible to determine an estimate for the signal’s direction of arrival. The method is demonstrated and evaluated using results from both numerical and practical implementations and performance data is provided. The use of Micro-Electromechanical Systems (MEMS) sensors allows time-modulation techniques to be applied at ultrasonic frequencies. Theoretical predictions for an array of five isotropic elements with half-wavelength spacing and 1000 data samples suggest an accuracy of

\pm 1^{\circ}

within an angular range of approximately

\pm 50^{\circ}

. In experiments of a 40 kHz five-element microphone array, a Direction of Arrival (DoA) estimation within

\pm 2 . 5^{\circ}

of the target signal is readily achieved inside a

\pm 45^{\circ}

range using a single switched input stage and a simple hardware setup. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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5360 KiB

Open AccessArticle

A Low Cost VLSI Architecture for Spike Sorting Based on Feature Extraction with Peak Search

by Yuan-Jyun Chang, Wen-Jyi Hwang and Chih-Chang Chen

Sensors 2016, 16(12), 2084; https://doi.org/10.3390/s16122084 - 07 Dec 2016

Cited by 2 | Viewed by 4609

Abstract

The goal of this paper is to present a novel VLSI architecture for spike sorting with high classification accuracy, low area costs and low power consumption. A novel feature extraction algorithm with low computational complexities is proposed for the design of the architecture. In the feature extraction algorithm, a spike is separated into two portions based on its peak value. The area of each portion is then used as a feature. The algorithm is simple to implement and less susceptible to noise interference. Based on the algorithm, a novel architecture capable of identifying peak values and computing spike areas concurrently is proposed. To further accelerate the computation, a spike can be divided into a number of segments for the local feature computation. The local features are subsequently merged with the global ones by a simple hardware circuit. The architecture can also be easily operated in conjunction with the circuits for commonly-used spike detection algorithms, such as the Non-linear Energy Operator (NEO). The architecture has been implemented by an Application-Specific Integrated Circuit (ASIC) with 90-nm technology. Comparisons to the existing works show that the proposed architecture is well suited for real-time multi-channel spike detection and feature extraction requiring low hardware area costs, low power consumption and high classification accuracy. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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1743 KiB

Open AccessArticle

Performance and Durability of Thin Film Thermocouple Array on a Porous Electrode

by Erdogan Guk, Manoj Ranaweera, Vijay Venkatesan and Jung-Sik Kim

Sensors 2016, 16(9), 1329; https://doi.org/10.3390/s16091329 - 23 Aug 2016

Cited by 18 | Viewed by 6262

Abstract

Management of solid oxide fuel cell (SOFC) thermal gradients is vital to limit thermal expansion mismatch and thermal stress. However, owing to harsh operation conditions of SOFCs and limited available space in stack configuration, the number of techniques available to obtain temperature distribution from the cell surface is limited. The authors previously developed and studied a thermocouple array pattern to detect surface temperature distribution on an SOFC in open circuit conditions. In this study, the performance in terms of mechanical durability and oxidation state of the thin film thermoelements of the thermocouple array on the porous SOFC cathode is investigated. A thin-film multi-junction thermocouple array was sputter deposited using a magnetron sputter coater. Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) characterisation techniques were carried out to understand characteristics of the thin film before and after temperature (20 °C–800 °C) measurement. Temperature readings from the sensor agreed well with the closely placed commercial thermocouple during heating segments. However, a sensor failure occurred at around 350 °C during the cooling segment. The SEM and XPS tests revealed cracks on the thin film thermoelements and oxidation to the film thickness direction. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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6405 KiB

Open AccessArticle

Experimental Analysis of Bisbenzocyclobutene Bonded Capacitive Micromachined Ultrasonic Transducers

by Rayyan Manwar and Sazzadur Chowdhury

Sensors 2016, 16(7), 959; https://doi.org/10.3390/s16070959 - 24 Jun 2016

Cited by 10 | Viewed by 5254

Abstract

Experimental measurement results of a 1.75 mm × 1.75 mm footprint area Capacitive Micromachined Ultrasonic Transducer (CMUT) planar array fabricated using a bisbenzocyclobutene (BCB)-based adhesive wafer bonding technique has been presented. The array consists of 40 × 40 square diaphragm CMUT cells with a cavity thickness of 900 nm and supported by 10 µm wide dielectric spacers patterned on a thin layer of BCB. A 150 µm wide one µm thick gold strip has been used as the contact pad for gold wire bonding. The measured resonant frequency of 19.3 MHz using a Polytec™ laser Doppler vibrometer (Polytec™ MSA-500) is in excellent agreement with the 3-D FEA simulation result using IntelliSuite™. An Agilent ENA5061B vector network analyzer (VNA) has been used for impedance measurement and the resonance and anti-resonance values from the imaginary impedance curve were used to determine the electromechanical coupling co-efficient. The measured coupling coefficient of 0.294 at 20 V DC bias exhibits 40% higher transduction efficiency as compared to a measured value published elsewhere for a silicon nitride based CMUT. A white light interferometry method was used to measure the diaphragm deflection profiles at different DC bias. The diaphragm center velocity was measured for different sub-resonant frequencies using a Polytec™ laser Doppler vibrometer that confirms vibration of the diaphragm at different excitation frequencies and bias voltages. Transmit and receive operations of CMUT cells were characterized using a pitch-catch method and a −6 dB fractional bandwidth of 23% was extracted from the received signal in frequency domain. From the measurement, it appears that BCB-based CMUTs offer superior transduction efficiency as compared to silicon nitride or silicon dioxide insulator-based CMUTs, and provide a very uniform deflection profile thus making them a suitable candidate to fabricate highly energy efficient CMUTs. Full article

(This article belongs to the Special Issue Integrated Sensor Arrays and Array Signal Processing)

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