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Selected Papers from IEEE ICICE 2018

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 January 2019) | Viewed by 610

Special Issue Editors


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Guest Editor
Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Interests: optical and electronic devices; semi-conductive materials; nanotechnology
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Guest Editor
Department of Electronic Engineering National Formosa University, Yunlin 632, Taiwan
Interests: IOT devices; photovoltaic devices; STEM education
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Guest Editor
Aeronautics, Astronautics and Computational Engineering, University of Southampton, Southampton SO16 7QF, UK
Interests: microsystem design; nanotechnology
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Special Issue Information

Dear Colleagues,

The 2018 IEEE International Conference on Information, Communication and Engineering (IEEE ICICE 2018, http://2018.icice.net/) will be held in Xiamen, Fujian, P.R. China, 28–30 September, 2018, and will provide a unified communication platform for a wide range of topics. In recent years, application of advanced materials in microelectronic and optical sensors has been a highly developing field. Due to the flexibility and light weight for daily use, it has the potential to be deployable. The scopes of IEEE ICICE 2018 not only encompass material sizes at the nanoscale, but also various dimensions where the onset of size-dependent phenomena usually enables novel applications.

This Special Issue selects excellent papers from IEEE ICICE 2018 and covers fundamental materials of electrical and optical engineering, including their synthesis, engineering, integration with many elements, designing of electrical or optical devices, evaluation of various performances, and exploring their broad applications, such as in industry, environmental control, material analysis, etc. We invite investigators to contribute original research articles, as well as review articles, that will stimulate continuing efforts to understand microelectronic and optical sensors. Potential topics include, but are not limited to:

  • Advanced materials with new electronic and optical properties
  • Advanced materials for preparation and applications
  • Subjects related to electro-optical thin films and coatings
  • Synthesis engineering in advanced materials
  • Properties of microelectronic and optical sensors

Prof. Dr. Shoou-Jinn Chang
Prof. Dr. Teen­-Hang Meen
Dr. Stephen D. Prior
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced materials
  • microelectronic devices
  • optical sensors

Published Papers

There is no accepted submissions to this special issue at this moment.
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