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Selected Papers from the International Conference on Next-Generation Electronics & Photonics (INGEP 2024)

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 25 October 2024 | Viewed by 1568

Special Issue Editors


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Guest Editor
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: optoelectronics; micro-spectrometers; wavelength tunable lasers; thermoelectricity; flexible electronics

E-Mail Website
Guest Editor
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: ultrafast photonics; semiconductor optoelectronics; integrated micro/nano photonics
Special Issues, Collections and Topics in MDPI journals
College of Information Science & Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: silicon-based micro/nanofabrication; electrokinetic-based separation and enrichment methods; biomicrofluidics; biosensors and lab-on-a-chip systems for biomedical applications
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: sensors; 2D materials and devices; bio-electronic devices and medical devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The International Conference on Next-Generation Electronics & Photonics (INGEP 2024) will be held in Hangzhou, China, on 11–14 April 2024. The INGEP 2024 will provide a platform for experts, scholars and researchers from all over the world to convene and share novel ideas on next-generation electronics and photonics.

The INGEP 2024 will feature plenary and invited talks by prominent scholars and scientists in advanced microelectronic and photonic devices and materials. The topics covered are listed below:

  • Advanced electronic devices, memory devices, electronic systems;
  • Low-dimension materials, devices and technologies;
  • Wide band gap semiconductor materials, devices and technologies;
  • Flexible and wearable electronics;
  • Optoelectronic devices and systems and advanced display technologies;
  • Nanophotonics;
  • Integrated quantum photonics;
  • Photovoltaic materials and technologies;
  • Advanced sensors, actuators, MEMS;
  • BioMEMS, biomedical devices and microfluidics;
  • Energy harvesting technologies;
  • Wireless sensing technologies.

Authors of selected high-quality papers that fit Sensors’ scope from the conference will be invited to submit extended versions of their original papers (50% extensions of contents of the conference paper). In addition to the INGEP 2024 papers, other independent submissions are also welcome. The subject of these contributions should be the same research topics as the ones in the conference.

Prof. Dr. Zongyin Yang
Prof. Dr. Chaoyuan Jin
Dr. Hao Jin
Dr. Xiaozhi Wang
Prof. Dr. Jikui Luo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronic sensors, devices and systems
  • flexible & wearable electronics
  • optoelectronic devices and systems
  • nanophotonics
  • sensors, actuators, MEMS
  • energy harvesting
  • wireless sensing

Published Papers (2 papers)

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Research

10 pages, 4717 KiB  
Article
A Programmable Ambient Light Sensor with Dark Current Compensation and Wide Dynamic Range
by Nianbo Shi, Jian Yang, Zhixiang Cao and Xiangliang Jin
Sensors 2024, 24(11), 3396; https://doi.org/10.3390/s24113396 - 24 May 2024
Viewed by 253
Abstract
Ambient light sensors are becoming increasingly popular due to their effectiveness in extending the battery life of portable electronic devices. However, conventional ambient light sensors are large in area and small in dynamic range, and they do not take into account the effects [...] Read more.
Ambient light sensors are becoming increasingly popular due to their effectiveness in extending the battery life of portable electronic devices. However, conventional ambient light sensors are large in area and small in dynamic range, and they do not take into account the effects caused due to a dark current. To address the above problems, a programmable ambient light sensor with dark current compensation and a wide dynamic range is proposed in this paper. The proposed ambient light sensor exhibits a low current power consumption of only 7.7 µA in dark environments, and it operates across a wide voltage range (2–5 V) and temperature range (−40–80 °C). It senses ambient light and provides an output current proportional to the ambient light intensity, with built-in dark current compensation to effectively suppress the effects of a dark current. It provides a wide dynamic range over the entire operating temperature range with three selectable output-current gain modes. The proposed ambient light sensor was designed and fabricated using a 0.18 µm standard CMOS process, and the effective area of the chip is 663 µm × 652 µm. The effectiveness of the circuit was verified through testing, making it highly suitable for portable electronic products and fluorescent fiber-optic temperature sensors. Full article
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11 pages, 3826 KiB  
Article
Design and Fabrication of a Film Bulk Acoustic Wave Filter for 3.0 GHz–3.2 GHz S-Band
by Chao Gao, Yupeng Zheng, Haiyang Li, Yuqi Ren, Xiyu Gu, Xiaoming Huang, Yaxin Wang, Yuanhang Qu, Yan Liu, Yao Cai and Chengliang Sun
Sensors 2024, 24(9), 2939; https://doi.org/10.3390/s24092939 - 5 May 2024
Viewed by 653
Abstract
Film bulk acoustic-wave resonators (FBARs) are widely utilized in the field of radio frequency (RF) filters due to their excellent performance, such as high operation frequency and high quality. In this paper, we present the design, fabrication, and characterization of an FBAR filter [...] Read more.
Film bulk acoustic-wave resonators (FBARs) are widely utilized in the field of radio frequency (RF) filters due to their excellent performance, such as high operation frequency and high quality. In this paper, we present the design, fabrication, and characterization of an FBAR filter for the 3.0 GHz–3.2 GHz S-band. Using a scandium-doped aluminum nitride (Sc0.2Al0.8N) film, the filter is designed through a combined acoustic–electromagnetic simulation method, and the FBAR and filter are fabricated using an eight-step lithographic process. The measured FBAR presents an effective electromechanical coupling coefficient (keff2) value up to 13.3%, and the measured filter demonstrates a −3 dB bandwidth of 115 MHz (from 3.013 GHz to 3.128 GHz), a low insertion loss of −2.4 dB, and good out-of-band rejection of −30 dB. The measured 1 dB compression point of the fabricated filter is 30.5 dBm, and the first series resonator burns out first as the input power increases. This work paves the way for research on high-power RF filters in mobile communication. Full article
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