High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites
Abstract
:1. Introduction
2. Recovery and Characterization of WPCB Non-Metallic Components
2.1. Recovery of WPCB Non-Metallic Components
2.2. Compositions and Structure of WPCB Non-Metals
3. Reutilization of WPCB Non-Metallic Components in Sustainable Polymer Composites
3.1. Reutilization of WPCB Non-Metallic Components in Thermosetting Composites
3.2. Reutilization of WPCB Non-Metallic Components in Thermoplastic Composites
3.3. Reutilization of WPCB Non-Metallic Components in Rubber Composites
4. Summary, Challenges, and Outlook
- (1)
- The WPCB non-metals are diverse and complex in terms of type, size, shape, components, and composition, typically including cured thermosetting resins, glass fiber (cellulose paper), ceramics, BFRs, residual metals, and other additives. Thus, the recovery process of WPCBs non-metallic components is also very complicated. In general, the methods of recovering non-metallic components from WPCB include physical recycling methods and chemical recycling methods. Physical recycling of the WPCB non-metals is a promising environmentally friendly recycling method that requires appropriate equipment investment and low energy costs. More work should be performed to explore comprehensive and industrialized application of the recovered WPCB non-metals through physical methods. However, there are still some issues related to the physical process of recycling WPCBs. It is generally very difficult to completely remove all metals through the physical recycling process, and some residual metals in the as-reclaimed non-metallic components may lead to the serious deterioration of the aging properties of polymer composites. Moreover, other than the glass fibers, residual metals, and resin powders, the influence of other metal derivatives and additives on the structures and properties of polymer composites is also worth studying in depth.
- (2)
- Many studies have indicated that the addition of WPCB non-metallic components to polymer composites can indeed effectively reduce the cost of polymer composites and enhance their comprehensive properties to some extent, which is also critically significant in terms of relieving the environmental pollution caused by inappropriate traditional recycling methods. However, it is still challenging to achieve the strong interfacial interaction between polymer matrix and unmodified WPCB non-metals, causing the superiority of WPCB non-metals with a high aspect ratio not to have been fully exploited. Moreover, many thermoplastics and rubbers have poor weathering properties and are sensitive to heat, UV exposure, and oxidation, whereas some residual metals in the as-reclaimed non-metallic components can further aggravate the deterioration of the aging properties of polymer composites, which severely limits their widespread use, especially in outdoor applications. Consequently, it is highly advisable to develop and introduce some novel interfacial modifiers and antioxidants in polymer composites to further optimize the interfaces and endow the polymer composites with longer service lives. Moreover, the reliability and potential environmental risks of as-prepared sustainable composites need to be taken into account because of the residual metals and bromide flame retardants.
- (3)
- Although the high value-added reutilization of WPCB non-metals in polymer composites has received a series of impressive advances, the recovery problem associated with WPCB non-metals has not been fundamentally solved, especially for cured thermosetting composites, which only extend the service life to a certain extent. In fact, if the thermosetting resin in PCB can be effectively degraded into small molecules or dissolved in some solvents, the recycling process of WPCB would become very simple, which is also in line with the strategy goals of “carbon peaking and carbon neutrality”. Therefore, it is not only necessary to carry out research into the high-value resource utilization of WPCB non-metals, but also to pay attention to the development of sustainable polymer matrixes, such as natural bio-based polymers, degradable synthetic polymers, etc. Moreover, this approach is expected to introduce the dynamic chemical bonds into thermosetting resins to prepare recyclable thermosets through molecular design. There is also an urgent need to develop a new generation of environmentally friendly bio-based additives, such as bio-based flame retardants, curing agents, antioxidants, etc. In conclusion, by systematically summarizing the relevant advances and investigating their preparation–structure–properties–applications relationships, we hope that this work can offer meaningful insights regarding the high value-added reutilization of WPCB non-metals in polymer composites.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
- Chen, Y.; Ke, Y.; Liang, S.; Hu, J.; Hou, H.; Yang, J. Enhanced bromine fixation and tar lightweighting in co-pyrolysis of non-metallic fractions of waste printed circuit boards with Bayer red mud. Waste Manag. 2023, 162, 72–82. [Google Scholar]
- Ghosh, B.; Ghosh, M.K.; Parhi, P.; Mukherjee, P.S.; Mishra, B.K. Waste Printed Circuit Boards recycling: An extensive assessment of current status. J. Clean. Prod. 2015, 94, 5–19. [Google Scholar]
- Niu, B.; Shanshan, E.; Xu, Z.; Guo, J. How to efficient and high-value recycling of electronic components mounted on waste printed circuit boards: Recent progress, challenge, and future perspectives. J. Clean. Prod. 2023, 415, 137815. [Google Scholar]
- Pan, X.; Wong, C.W.Y.; Li, C. Circular economy practices in the waste electrical and electronic equipment (WEEE) industry: A systematic review and future research agendas. J. Clean. Prod. 2022, 365, 132671. [Google Scholar]
- Ramprasad, C.; Gwenzi, W.; Chaukura, N.; Izyan Wan Azelee, N.; Upamali Rajapaksha, A.; Naushad, M.; Rangabhashiyam, S. Strategies and options for the sustainable recovery of rare earth elements from electrical and electronic waste. Chem. Eng. J. 2022, 442, 135992. [Google Scholar]
- Islam, M.T.; Huda, N. Reverse logistics and closed-loop supply chain of Waste Electrical and Electronic Equipment (WEEE)/E-waste: A comprehensive literature review. Resour. Conserv. Recycl. 2018, 137, 48–75. [Google Scholar]
- Gautam, P.; Behera, C.K.; Sinha, I.; Gicheva, G.; Singh, K.K. High added-value materials recovery using electronic scrap-transforming waste to valuable products. J. Clean. Prod. 2022, 330, 129836. [Google Scholar]
- Faraji, F.; Golmohammadzadeh, R.; Pickles, C.A. Potential and current practices of recycling waste printed circuit boards: A review of the recent progress in pyrometallurgy. J. Environ. Manage. 2022, 316, 115242. [Google Scholar]
- Rene, E.R.; Sethurajan, M.; Kumar Ponnusamy, V.; Kumar, G.; Bao Dung, T.N.; Brindhadevi, K.; Pugazhendhi, A. Electronic waste generation, recycling and resource recovery: Technological perspectives and trends. J. Hazard. Mater. 2021, 416, 125664. [Google Scholar]
- Kiddee, P.; Naidu, R.; Wong, M.H. Electronic waste management approaches: An overview. Waste Manag. 2013, 33, 1237–1250. [Google Scholar]
- Li, J.; Lu, H.; Guo, J.; Xu, Z.; Zhou, Y. Recycle Technology for Recovering Resources and Products from Waste Printed Circuit Boards. Environ. Sci. Technol. 2007, 41, 1995–2000. [Google Scholar] [PubMed]
- Wang, J.; Guo, J.; Xu, Z. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards. Waste Manag. 2016, 53, 218–224. [Google Scholar] [PubMed]
- Zhou, Y.; Qiu, K. A new technology for recycling materials from waste printed circuit boards. J. Hazard. Mater. 2010, 175, 823–828. [Google Scholar] [PubMed]
- Huang, K.; Guo, J.; Xu, Z. Recycling of waste printed circuit boards: A review of current technologies and treatment status in China. J. Hazard. Mater. 2009, 164, 399–408. [Google Scholar] [CrossRef] [PubMed]
- Rigoldi, A.; Trogu, E.F.; Marcheselli, G.C.; Artizzu, F.; Picone, N.; Colledani, M.; Deplano, P.; Serpe, A. Advances in Recovering Noble Metals from Waste Printed Circuit Boards (WPCBs). ACS Sustain. Chem. Eng. 2019, 7, 1308–1317. [Google Scholar]
- He, J.; Duan, C. Recovery of metallic concentrations from waste printed circuit boards via reverse floatation. Waste Manag. 2017, 60, 618–628. [Google Scholar] [PubMed]
- Guo, J.; Guo, J.; Xu, Z. Recycling of non-metallic fractions from waste printed circuit boards: A review. J. Hazard. Mater. 2009, 168, 567–590. [Google Scholar]
- Cozza, G.; D’Adamo, I.; Rosa, P. Circular manufacturing ecosystems: Automotive printed circuit boards recycling as an enabler of the economic development. Prod. Manuf. Res. 2023, 11, 2182837. [Google Scholar]
- Lin, K.-H.; Tsai, J.-H.; Lan, C.-L.; Chiang, H.-L. The effect of microwave pyrolysis on product characteristics and bromine migration for a non-metallic printed circuit board. Waste Manag. 2022, 153, 147–155. [Google Scholar]
- Chen, W.; Chen, Y.; Shu, Y.; He, Y.; Wei, J. Characterization of solid, liquid and gaseous products from waste printed circuit board pyrolysis. J. Clean. Prod. 2021, 313, 127881. [Google Scholar]
- Zhang, G.; Wang, H.; He, Y.; Yang, X.; Peng, Z.; Zhang, T.; Wang, S. Triboelectric separation technology for removing inorganics from non-metallic fraction of waste printed circuit boards: Influence of size fraction and process optimization. Waste Manag. 2017, 60, 42–49. [Google Scholar]
- Preetam, A.; Mishra, S.; Naik, S.N.; Pant, K.K.; Kumar, V. A sustainable approach for material and metal recovery from E-waste using subcritical to supercritical methanol. Waste Manag. 2022, 145, 29–37. [Google Scholar] [PubMed]
- Hu, D.; Jia, Z.; Li, J.; Zhong, B.; Fu, W.; Luo, Y.; Jia, D. Characterization of Waste Printed Circuit Boards Nonmetals and its Reutilization as Reinforcing Filler in Unsaturated Polyester Resin. J. Polym. Environ. 2018, 26, 1311–1319. [Google Scholar]
- Guo, J.; Guo, J.; Wang, S.; Xu, Z. Asphalt Modified with Nonmetals Separated from Pulverized Waste Printed Circuit Boards. Environ. Sci. Technol. 2009, 43, 503–508. [Google Scholar]
- Guo, J.; Tang, Y.; Xu, Z. Wood Plastic Composite Produced by Nonmetals from Pulverized Waste Printed Circuit Boards. Environ. Sci. Technol. 2010, 44, 463–468. [Google Scholar]
- Kakria, K.; Thirumalini, S.; Secco, M.; Shanmuga Priya, T. A novel approach for the development of sustainable hybridized geopolymer mortar from waste printed circuit boards. Resour. Conserv. Recycl. 2020, 163, 105066. [Google Scholar]
- Meng, Y.; Liao, Y.; Liu, Z.; Chen, J.; Yang, X.; Rong, H. Study on Rheological Properties of Bituminous Binders and Mixtures Containing Waste Printed Circuit Boards (PCBs) and SBR Compound Modified Bitumen. Materials 2021, 14, 1697. [Google Scholar]
- Hadi, P.; Xu, M.; Lin, C.S.K.; Hui, C.-W.; McKay, G. Waste printed circuit board recycling techniques and product utilization. J. Hazard. Mater. 2015, 283, 234–243. [Google Scholar] [PubMed]
- Qiu, R.; Lin, M.; Qin, B.; Xu, Z.; Ruan, J. Environmental-friendly recovery of non-metallic resources from waste printed circuit boards: A review. J. Clean. Prod. 2021, 279, 123738. [Google Scholar]
- Duan, H.; Hu, J.; Yuan, W.; Wang, Y.; Yu, D.; Song, Q.; Li, J. Characterizing the environmental implications of the recycling of non-metallic fractions from waste printed circuit boards. J. Clean. Prod. 2016, 137, 546–554. [Google Scholar]
- Faraji, F.; Golmohammadzadeh, R.; Rashchi, F.; Alimardani, N. Fungal bioleaching of WPCBs using Aspergillus niger: Observation, optimization and kinetics. J. Environ. Manag. 2018, 217, 775–787. [Google Scholar]
- Lu, Y.; Yang, B.; Gao, Y.; Xu, Z. An automatic sorting system for electronic components detached from waste printed circuit boards. Waste Manag. 2022, 137, 1–8. [Google Scholar] [PubMed]
- Chen, W.; Shu, Y.; Li, Y.; Chen, Y.; Wei, J. Co-pyrolysis of waste printed circuit boards with iron compounds for Br-fixing and material recovery. Environ. Sci. Pollut. Res. 2021, 28, 64642–64651. [Google Scholar]
- Chandane, P.; Jori, C.; Chaudhari, H.; Bhapkar, S.; Deshmukh, S.; Jadhav, U. Bioleaching of copper from large printed circuit boards for synthesis of organic-inorganic hybrid. Environ. Sci. Pollut. Res. 2020, 27, 5797–5808. [Google Scholar]
- Zheng, Y.; Shen, Z.; Cai, C.; Ma, S.; Xing, Y. The reuse of nonmetals recycled from waste printed circuit boards as reinforcing fillers in the polypropylene composites. J. Hazard. Mater. 2009, 163, 600–606. [Google Scholar]
- Touze, S.; Guignot, S.; Hubau, A.; Devau, N.; Chapron, S. Sampling waste printed circuit boards: Achieving the right combination between particle size and sample mass to measure metal content. Waste Manag. 2020, 118, 380–390. [Google Scholar]
- Zhou, X.; Guo, J.; Lin, K.; Huang, K.; Deng, J. Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards. J. Hazard. Mater. 2013, 246–247, 96–102. [Google Scholar]
- Hao, J.; Wang, Y.; Wu, Y.; Guo, F. Metal recovery from waste printed circuit boards: A review for current status and perspectives. Resour. Conserv. Recycl. 2020, 157, 104787. [Google Scholar]
- Qiu, R.; Lin, M.; Ruan, J.; Fu, Y.; Hu, J.; Deng, M.; Tang, Y.; Qiu, R. Recovering full metallic resources from waste printed circuit boards: A refined review. J. Clean. Prod. 2020, 244, 118690. [Google Scholar]
- Lu, Y.; Xu, Z. Precious metals recovery from waste printed circuit boards: A review for current status and perspective. Resour. Conserv. Recycl. 2016, 113, 28–39. [Google Scholar]
- Akcil, A.; Erust, C.; Gahan, C.S.; Ozgun, M.; Sahin, M.; Tuncuk, A. Precious metal recovery from waste printed circuit boards using cyanide and non-cyanide lixiviants—A review. Waste Manag. 2015, 45, 258–271. [Google Scholar]
- Shin, S.-R.; Mai, V.D.; Lee, D.-S. Chemical Recycling of Used Printed Circuit Board Scraps: Recovery and Utilization of Organic Products. Processes 2019, 7, 22. [Google Scholar] [CrossRef]
- Zhang, T.; Mao, X.; Qu, J.; Liu, Y.; Siyal, A.A.; Ao, W.; Fu, J.; Dai, J.; Jiang, Z.; Deng, Z.; et al. Microwave-assisted catalytic pyrolysis of waste printed circuit boards, and migration and distribution of bromine. J. Hazard. Mater. 2021, 402, 123749. [Google Scholar] [PubMed]
- Liu, J.; Zhan, L.; Xu, Z. Debromination with Bromine Recovery from Pyrolysis of Waste Printed Circuit Boards Offers Economic and Environmental Benefits. Environ. Sci. Technol. 2023, 57, 3496–3504. [Google Scholar] [PubMed]
- Chen, Y.; Liang, S.; Xiao, K.; Hu, J.; Hou, H.; Liu, B.; Deng, H.; Yang, J. A cost-effective strategy for metal recovery from waste printed circuit boards via crushing pretreatment combined with pyrolysis: Effects of particle size and pyrolysis temperature. J. Clean. Prod. 2021, 280, 124505. [Google Scholar]
- Sun, J.; Wang, W.; Liu, Z.; Ma, C. Recycling of Waste Printed Circuit Boards by Microwave-Induced Pyrolysis and Featured Mechanical Processing. Ind. Eng. Chem. Res. 2011, 50, 11763–11769. [Google Scholar] [CrossRef]
- Li, C.; Xia, H.; Liu, C.; Zeng, K. Steam gasification assisted pyrolysis directional de bromination of waste printed circuit boards and comprehensive utilization of products. J. Clean. Prod. 2022, 366, 132979. [Google Scholar]
- Salbidegoitia, J.A.; Fuentes-Ordóñez, E.G.; González-Marcos, M.P.; González-Velasco, J.R.; Bhaskar, T.; Kamo, T. Steam gasification of printed circuit board from e-waste: Effect of coexisting nickel to hydrogen production. Fuel Process. Technol. 2015, 133, 69–74. [Google Scholar]
- Zhu, J.; Chen, X.; Yao, Z.; Yin, Y.; Lin, K.; Liu, H.; Huang, J.; Ruan, J.; Qiu, R. Directional concentration of bromine from nonmetallic particles of crushed waste printed circuit boards by vacuum-gasification-condensation. J. Clean. Prod. 2019, 231, 462–467. [Google Scholar]
- Wang, H.; Hirahara, M.; Goto, M.; Hirose, T. Extraction of flame retardants from electronic printed circuit board by supercritical carbon dioxide. J. Supercrit. Fluids 2004, 29, 251–256. [Google Scholar]
- Xiu, F.-R.; Zhang, F.-S. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process. J. Hazard. Mater. 2009, 165, 1002–1007. [Google Scholar] [CrossRef] [PubMed]
- Ozaki, J.-i.; Djaja, S.K.I.; Oya, A. Chemical Recycling of Phenol Resin by Supercritical Methanol. Ind. Eng. Chem. Res. 2000, 39, 245–249. [Google Scholar]
- Tagaya, H.; Shibasaki, Y.; Kato, C.; Kadokawa, J.-I.; Hatano, B. Decomposition reactions of epoxy resin and polyetheretherketone resin in sub- and supercritical water. J. Mater. Cycles Waste Manag. 2004, 6, 1–5. [Google Scholar]
- Chien, Y.-C.; Wang, H.P.; Lin, K.-S.; Yang, Y.W. Oxidation of printed circuit board wastes in supercritical water. Water Res. 2000, 34, 4279–4283. [Google Scholar]
- Xiu, F.-R.; Zhang, F.-S. Materials recovery from waste printed circuit boards by supercritical methanol. J. Hazard. Mater. 2010, 178, 628–634. [Google Scholar] [CrossRef]
- Wang, Y.; Zhang, F.-S. Degradation of brominated flame retardant in computer housing plastic by supercritical fluids. J. Hazard. Mater. 2012, 205–206, 156–163. [Google Scholar]
- Yousef, S.; Tatariants, M.; Tichonovas, M.; Bendikiene, R.; Denafas, G. Recycling of bare waste printed circuit boards as received using an organic solvent technique at a low temperature. J. Clean. Prod. 2018, 187, 780–788. [Google Scholar]
- Zhu, P.; Chen, Y.; Wang, L.Y.; Zhou, M.; Zhou, J. The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent. Waste Manag. 2013, 33, 484–488. [Google Scholar] [CrossRef]
- Tatariants, M.; Yousef, S.; Sidaraviciute, R.; Denafas, G.; Bendikiene, R. Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures. RSC Adv. 2017, 7, 37729–37738. [Google Scholar] [CrossRef]
- Kumar, A.; Kuppusamy, V.K.; Holuszko, M.E.; Janke, T. Improving the Energy Concentration in Waste Printed Circuit Boards Using Gravity Separation. Recycling 2018, 3, 21. [Google Scholar]
- Zhu, X.-n.; Nie, C.-c.; Wang, S.-s.; Xie, Y.; Zhang, H.; Lyu, X.-j.; Qiu, J.; Li, L. Cleaner approach to the recycling of metals in waste printed circuit boards by magnetic and gravity separation. J. Clean. Prod. 2020, 248, 119235. [Google Scholar]
- Wang, Q.; Zhang, B.; Yu, S.; Xiong, J.; Yao, Z.; Hu, B.; Yan, J. Waste-Printed Circuit Board Recycling: Focusing on Preparing Polymer Composites and Geopolymers. ACS Omega 2020, 5, 17850–17856. [Google Scholar] [CrossRef]
- Li, J.; Xu, Z.; Zhou, Y. Application of corona discharge and electrostatic force to separate metals and nonmetals from crushed particles of waste printed circuit boards. J. Electrostat. 2007, 65, 233–238. [Google Scholar] [CrossRef]
- Wu, J.; Li, J.; Xu, Z. Electrostatic Separation for Recovering Metals and Nonmetals from Waste Printed Circuit Board: Problems and Improvements. Environ. Sci. Technol. 2008, 42, 5272–5276. [Google Scholar] [PubMed]
- Jiang, W.; Jia, L.; Zhen-ming, X. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board. J. Hazard. Mater. 2009, 161, 257–262. [Google Scholar]
- Li, J.; Jiang, Y.; Xu, Z. Eddy current separation technology for recycling printed circuit boards from crushed cell phones. J. Clean. Prod. 2017, 141, 1316–1323. [Google Scholar]
- Huang, Z.; Zhu, J.; Wu, X.; Qiu, R.; Xu, Z.; Ruan, J. Eddy current separation can be used in separation of non-ferrous particles from crushed waste printed circuit boards. J. Clean. Prod. 2021, 312, 127755. [Google Scholar]
- Li, J.; Gao, B.; Xu, Z. New Technology for Separating Resin Powder and Fiberglass Powder from Fiberglass–Resin Powder of Waste Printed Circuit Boards. Environ. Sci. Technol. 2014, 48, 5171–5178. [Google Scholar] [CrossRef]
- Hall, W.J.; Williams, P.T. Separation and recovery of materials from scrap printed circuit boards. Resour. Conserv. Recycl. 2007, 51, 691–709. [Google Scholar] [CrossRef]
- Weber, R.; Kuch, B. Relevance of BFRs and thermal conditions on the formation pathways of brominated and brominated–chlorinated dibenzodioxins and dibenzofurans. Environ. Int. 2003, 29, 699–710. [Google Scholar] [CrossRef]
- Lai, Y.-C.; Lee, W.-J.; Li, H.-W.; Wang, L.-C.; Chang-Chien, G.-P. Inhibition of Polybrominated Dibenzo-p-dioxin and Dibenzofuran Formation from the Pyrolysis of Printed Circuit Boards. Environ. Sci. Technol. 2007, 41, 957–962. [Google Scholar] [CrossRef]
- Duan, H.; Li, J.; Liu, Y.; Yamazaki, N.; Jiang, W. Characterization and Inventory of PCDD/Fs and PBDD/Fs Emissions from the Incineration of Waste Printed Circuit Board. Environ. Sci. Technol. 2011, 45, 6322–6328. [Google Scholar] [CrossRef]
- Hu, D.; Luo, Y.; Lin, J.; Chen, Y.; Jia, D. Reutilization of waste printed circuit boards nonmetallic powders in elastomer composites: Significant improvements of curing and mechanical properties. Polym. Compos. 2020, 41, 2224–2232. [Google Scholar] [CrossRef]
- Guo, J.; Rao, Q.; Xu, Z. Effects of particle size of fiberglass–resin powder from PCBs on the properties and volatile behavior of phenolic molding compound. J. Hazard. Mater. 2010, 175, 165–171. [Google Scholar] [CrossRef] [PubMed]
- Guo, J.; Rao, Q.; Xu, Z. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound. J. Hazard. Mater. 2008, 153, 728–734. [Google Scholar] [CrossRef]
- Guo, J.; Li, J.; Rao, Q.; Xu, Z. Phenolic Molding Compound Filled with Nonmetals of Waste PCBs. Environ. Sci. Technol. 2008, 42, 624–628. [Google Scholar] [CrossRef]
- Guo, J.; Lin, K.; Xu, Z. Curing kinetic analysis of phenolic resin filled with nonmetallic materials reclaimed from waste printed circuit boards. Thermochim Acta 2013, 556, 13–17. [Google Scholar] [CrossRef]
- Lu, J.-J.; Guan, J.-P.; Wang, H.-Q.; Dang, R.-Q.; Fan, M.-X.; Zhu, S.-Q.; Shen, X.-J. Investigation on compressive and impact performance of GO-modified hollow glass beads/epoxy resin composites in simulated deep-sea environment. Compos. Sci. Technol. 2022, 227, 109608. [Google Scholar] [CrossRef]
- Ning, N.; Wang, M.; Zhou, G.; Qiu, Y.; Wei, Y. Effect of polymer nanoparticle morphology on fracture toughness enhancement of carbon fiber reinforced epoxy composites. Compos. B. Eng. 2022, 234, 109749. [Google Scholar] [CrossRef]
- Zhang, C.; Ling, Y.; Zhang, X.; Liang, M.; Zou, H. Ultra-thin carbon fiber reinforced carbon nanotubes modified epoxy composites with superior mechanical and electrical properties for the aerospace field. Compos. Part A Appl. Sci. Manuf. 2022, 163, 107197. [Google Scholar] [CrossRef]
- Yokoyama, S.; Iji, M. Recycling of Printed Wiring Boards with Mounted Electronic Parts. In Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, USA, 5–7 May 1997; pp. 109–114, ISEE-1997. [Google Scholar]
- Mou, P.; Xiang, D.; Duan, G. Products made from nonmetallic materials reclaimed from waste printed circuit boards. Tsinghua Sci. Technol. 2007, 12, 276–283. [Google Scholar] [CrossRef]
- Chai, S. Study on the Properties of Epoxy /Recycling Nonmetallic Powders Composites. China Plast. Ind. 2013, 41, 32–34. [Google Scholar]
- Pączkowski, P.; Puszka, A.; Gawdzik, B. Effect of Eco-Friendly Peanut Shell Powder on the Chemical Resistance, Physical, Thermal, and Thermomechanical Properties of Unsaturated Polyester Resin Composites. Polymers 2021, 13, 3690. [Google Scholar] [CrossRef] [PubMed]
- Dhakal, H.N.; Zhang, Z.Y.; Richardson, M.O.W. Effect of water absorption on the mechanical properties of hemp fibre reinforced unsaturated polyester composites. Compos Sci. Technol. 2007, 67, 1674–1683. [Google Scholar] [CrossRef]
- Zhang, S.; Chu, F.; Xu, Z.; Zhou, Y.; Hu, W.; Hu, Y. Interfacial flame retardant unsaturated polyester composites with simultaneously improved fire safety and mechanical properties. Chem. Eng. J. 2021, 426, 131313. [Google Scholar] [CrossRef]
- Hong, S.G.; Su, S.H. The use of recycled printed circuit boards as reinforcing fillers in the polyester composite. J. Environ. Sci. Health A Environ. Sci. Eng. Toxicol. 1996, 31, 1345–1359. [Google Scholar] [CrossRef]
- Guo, J.; Cao, B.; Guo, J.; Xu, Z. A Plate Produced by Nonmetallic Materials of Pulverized Waste Printed Circuit Boards. Environ. Sci. Technol. 2008, 42, 5267–5271. [Google Scholar] [CrossRef]
- Hu, D.; Jia, Z.; Zhong, B.; Lin, J.; Liu, M.; Luo, Y.; Jia, D. Method for improving the mechanical performance and thermal stability of unsaturated polyester resin/waste-printed circuit board nonmetals composites via isocyanate chemistry. J. Appl. Polym. Sci. 2017, 134, 45129. [Google Scholar] [CrossRef]
- Hu, D.; Jia, Z.; Zhong, B.; Dong, H.; Ding, Y.; Luo, Y.; Jia, D. Preparation of WPCBP/SiO2 hybrid filler and its application in unsaturated polyester resin. Mater. Rep. 2018, 32, 278–281+287. [Google Scholar]
- Hu, D.; Jia, Z.; Zhong, B.; Ding, Y.; Chen, Y.; Luo, Y.; Jia, D. Effects of waste printed circuit boards powders and hallosite nanotubes on the thermal stability and flame retardancy for unsaturated polyester resin. Acta Mater. Compos. Sin. 2017, 34, 2187–2193. [Google Scholar]
- Cai, J.; Fu, Q.; Long, M.; Liao, G.; Xu, Z. The sound insulation property of composite from waste printed circuit board and unsaturated polyester. Compos Sci. Technol. 2017, 145, 132–137. [Google Scholar] [CrossRef]
- Luo, Z.; Dong, K.; Guo, M.; Liu, K.; Lian, Z.; Jing, Q.; Wei, W.; Zhang, B. Composite manhole covers prepared with recycled printed circuit boards as a reinforcing filler. Polym. Compos. 2018, 39, 4532–4541. [Google Scholar] [CrossRef]
- Xiong, X.; Ma, L.; Zhang, Z.; Yang, H. Mechanical, morphology, crystallisation and melting behaviour of polypropylene composites reinforced by non-metals recycled from waste printed circuit boards. Plast. Rubber Compos. 2021, 50, 162–171. [Google Scholar] [CrossRef]
- Wu, M.; Jiang, J.; Meng, C.; Hu, X.; Xie, H.; Wu, M.; Guo, Q. Polypropylene Composites Reinforced by Nonmetallic from Waste Printed Circuit Boards Using Spout-Fluid Bed Coating with PP Particles Enhance Fluidization. Polymers 2021, 13, 3106. [Google Scholar] [CrossRef] [PubMed]
- Kumar, A.; Choudhary, V.; Khanna, R.; Mukherjee, S.P.; Cayumil, R.; Ikram-ul-Haq, M.; Jayasankar, K.; Mishra, K.B.; Sahajwalla, V. Polymer Composites Utilizing Electronic Waste as Reinforcing Fillers: Mechanical and Rheological Properties. Curr. Appl. Polym. Sci. 2017, 1, 86–95. [Google Scholar] [CrossRef]
- Biswal, M.; Jada, N.; Mohanty, S.; Nayak, S.K. Recovery and utilisation of non-metallic fraction from waste printed circuit boards in polypropylene composites. Plast. Rubber Compos. 2015, 44, 314–321. [Google Scholar] [CrossRef]
- Wu, H.-Y.; Jia, L.-C.; Yan, D.-X.; Gao, J.-f.; Zhang, X.-P.; Ren, P.-G.; Li, Z.-M. Simultaneously improved electromagnetic interference shielding and mechanical performance of segregated carbon nanotube/polypropylene composite via solid phase molding. Compos Sci. Technol. 2018, 156, 87–94. [Google Scholar] [CrossRef]
- Awad, S.A.; Khalaf, E.M. Investigation of improvement of properties of polypropylene modified by nano silica composites. Compos. Commun. 2019, 12, 59–63. [Google Scholar] [CrossRef]
- Spoerk, M.; Savandaiah, C.; Arbeiter, F.; Traxler, G.; Cardon, L.; Holzer, C.; Sapkota, J. Anisotropic properties of oriented short carbon fibre filled polypropylene parts fabricated by extrusion-based additive manufacturing. Compos. Part A Appl. Sci. Manuf. 2018, 113, 95–104. [Google Scholar] [CrossRef]
- Zheng, Y.; Shen, Z.; Ma, S.; Cai, C.; Zhao, X.; Xing, Y. A novel approach to recycling of glass fibers from nonmetal materials of waste printed circuit boards. J. Hazard. Mater. 2009, 170, 978–982. [Google Scholar] [CrossRef]
- Zheng, Y.; Shen, Z.; Cai, C.; Ma, S.; Xing, Y. In situ observation of polypropylene composites reinforced by nonmetals recycled from waste printed circuit boards during tensile testing. J. Appl. Polym. Sci. 2009, 114, 1856–1863. [Google Scholar] [CrossRef]
- Zheng, Y.; Shen, Z.; Ma, S.; Cai, C.; Zhao, X.; Xing, Y.; Guo, B.; Zeng, X.; Wang, L. Influence of the recycled glass fibers from nonmetals of waste printed circuit boards on properties and reinforcing mechanism of polypropylene composites. J. Appl. Polym. Sci. 2010, 118, 2914–2920. [Google Scholar] [CrossRef]
- Zheng, Y.; Shen, Z.; Cai, C.; Ma, S.; Xing, Y. Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites. Mater. Des. 2009, 30, 958–963. [Google Scholar] [CrossRef]
- Xu, B.; Lin, Z.; Xian, J.; Huo, Z.; Cao, L.; Wang, Y.; Gaosun, W.; Mai, K.; Wang, Y. Preparation and characterization of polypropylene composites with nonmetallic materials recycled from printed circuit boards. J. Thermoplast. Compos. Mater. 2014, 29, 48–57. [Google Scholar] [CrossRef]
- Grigorescu, R.M.; Ghioca, P.; Iancu, L.; David, M.E.; Andrei, E.R.; Filipescu, M.I.; Ion, R.-M.; Vuluga, Z.; Anghel, I.; Sofran, I.-E.; et al. Development of thermoplastic composites based on recycled polypropylene and waste printed circuit boards. Waste Manag. 2020, 118, 391–401. [Google Scholar] [CrossRef]
- Tian, S.; Luo, Y.; Ma, Y.; He, H.; Jia, D.; Zhang, L.; Chen, Y. Effects of decoppering pretreatment on accelerated weathering behaviors of waste printed circuit boards powders reinforced polypropylene composites. J. Appl. Polym. Sci. 2019, 136, 48224. [Google Scholar] [CrossRef]
- Muniyandi, S.K.; Sohaili, J.; Hassan, A. Mechanical, thermal, morphological and leaching properties of nonmetallic printed circuit board waste in recycled HDPE composites. J. Clean. Prod. 2013, 57, 327–334. [Google Scholar] [CrossRef]
- Muniyandi, S.K.; Sohaili, J.; Hassan, A. Accelerated weathering properties of compatibilized composites made from recycled HDPE and nonmetallic printed circuit board waste. J. Appl. Polym. Sci. 2016, 133, 876. [Google Scholar] [CrossRef]
- Yang, S.; Bai, S.; Wang, Q. Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards. Waste Manag. 2016, 57, 168–175. [Google Scholar] [CrossRef]
- Moe, A.K.; Chungprempree, J.; Preechawong, J.; Sapsrithong, P.; Nithitanakul, M. Recycling Waste Nonmetallic Printed Circuit Boards for Polyvinyl Chloride Composites. Polymers 2022, 14, 3531. [Google Scholar] [CrossRef]
- Habib, M.; Sohaib, Q.; Ullah, A.; Habib, U.; Khan, A. Mechanical strength evaluation of composites made from waste printed circuit boards (PCBs). Part. Sci. Technol. 2016, 34, 301–307. [Google Scholar] [CrossRef]
- Das, R.K.; Gohatre, O.K.; Biswal, M.; Mohanty, S.; Nayak, S.K. Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire. Waste Manag. Res. 2019, 37, 569–577. [Google Scholar] [CrossRef] [PubMed]
- Grigorescu, R.M.; Ghioca, P.; Iancu, L.; David, M.E.; Ion, R.-M.; Nicolae, C.-A.; Gabor, R.A.; Radu, E.R.; Ganciarov, M.; Spurcaciu, B.; et al. Influence of non-metallic fraction of printed circuit boards waste on recycled polyvinyl chloride from waste wires. J. Appl. Polym. Sci. 2022, 139, 51469. [Google Scholar] [CrossRef]
- Wang, X.; Guo, Y.; Liu, J.; Qiao, Q.; Liang, J. PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders. J. Environ. Manag. 2010, 91, 2505–2510. [Google Scholar] [CrossRef] [PubMed]
- Moe, A.K.; Chungprempree, J.; Preechawong, J.; Sapsrithong, P.; Nithitanakul, M. The Development of Environmentally Sustainable Poly(vinyl chloride) Composite from Waste Non-Metallic Printed Circuit Board with Interfacial Agents. Polymers 2023, 15, 2938. [Google Scholar] [CrossRef] [PubMed]
- Leng, Y.-M.; Zhao, X.; Fu, T.; Wang, X.-L.; Wang, Y.-Z. Bio-Based Flame-Retardant and Smoke-Suppressing Wood Plastic Composites Enabled by Phytic Acid Tyramine Salt. ACS Sustain. Chem. Eng. 2022, 10, 5055–5066. [Google Scholar] [CrossRef]
- Jorda-Reolid, M.; Gomez-Caturla, J.; Ivorra-Martinez, J.; Stefani, P.M.; Rojas-Lema, S.; Quiles-Carrillo, L. Upgrading Argan Shell Wastes in Wood Plastic Composites with Biobased Polyethylene Matrix and Different Compatibilizers. Polymers 2021, 13, 922. [Google Scholar] [CrossRef]
- Zhou, X.; Fu, Q.; Zhang, Z.; Fang, Y.; Wang, Y.; Wang, F.; Song, Y.; Pittman, C.U.; Wang, Q. Efficient flame-retardant hybrid coatings on wood plastic composites by layer-by-layer assembly. J. Clean. Prod. 2021, 321, 128949. [Google Scholar] [CrossRef]
- Guo, J.; Tang, Y.; Xu, Z. Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards. J. Hazard. Mater. 2010, 179, 203–207. [Google Scholar] [CrossRef]
- Keskisaari, A.; Kärki, T. The use of waste materials in wood-plastic composites and their impact on the profitability of the product. Resour Conserv. Recycl. 2018, 134, 257–261. [Google Scholar] [CrossRef]
- Tian, S.; He, H.; Yu, P.; Zhou, L.; Luo, Y.; Jia, D. Sustainable utilization of waste printed circuit boards powders in HDPE-wood composites: Synergistic effects of multicomponents on structure and properties. J. Clean. Prod. 2017, 164, 840–847. [Google Scholar] [CrossRef]
- Tian, S.; Luo, Y.; Chen, J.; He, H.; Chen, Y.; Ling, Z. A Comprehensive Study on The Accelerated Weathering Properties of Polypropylene—Wood Composites with Non-Metallic Materials of Waste-Printed Circuit Board Powders. Materials 2019, 12, 876. [Google Scholar] [CrossRef] [PubMed]
- Yang, S.; Jiang, J.; Duan, W.; Bai, S.; Wang, Q. Production of sustainable wood-plastic composites from the nonmetals in waste printed circuit boards: Excellent physical performance achieved by solid-state shear milling. Compos Sci. Technol. 2020, 200, 108411. [Google Scholar] [CrossRef]
- Yang, S.; Jiang, J.; Wang, Q. The novel application of nonmetals from waste printed circuit board in high-performance thermal management materials. Compos. Part A Appl. Sci. Manuf. 2020, 139, 106096. [Google Scholar] [CrossRef]
- Sun, Z.; Shen, Z.; Zhang, X.; Ma, S. Co-recycling of acrylonitrile–butadiene–styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites. Environ. Technol. 2015, 36, 160–168. [Google Scholar] [CrossRef]
- Zhu, P.; Liu, X.; Wang, Y.; Guan, C.; Yang, Y.; Zhu, J.; Li, X.; Qian, G.; Frost, R.L. Production and characterization of recycled polycarbonate based composite material containing recycled glass fibers. J. Environ. Chem. Eng. 2017, 5, 3439–3446. [Google Scholar] [CrossRef]
- Zhong, B.; Zeng, X.; Chen, W.; Luo, Q.; Hu, D.; Jia, Z.; Jia, D. Nonsolvent-assisted surface modification of silica by silane and antioxidant for rubber reinforcement. Polym. Test 2019, 78, 105949. [Google Scholar] [CrossRef]
- Lin, J.; Hu, D.; Luo, Y.; Zhong, B.; Chen, Y.; Jia, Z.; Jia, D. Functionalized Halloysite Nanotubes–Silica Hybrid for Enhanced Curing and Mechanical Properties of Elastomers. Polymers 2019, 11, 883. [Google Scholar] [CrossRef]
- Lin, J.; Hu, D.; Luo, Y.; Zhong, B.; Jia, Z.; Xu, T.; Jia, D. Enhanced Mechanical Performance and Antioxidative Efficiency of Styrene–Butadiene Rubber via 4-Aminodiphenylamine Functionalized Mesoporous Silica. Ind. Eng. Chem. Res. 2018, 57, 4935–4940. [Google Scholar] [CrossRef]
- Yang, S.; Tian, J.; Bian, X.; Wu, Y. High performance NBR/fly ash composites prepared by an environment-friendly method. Compos Sci. Technol. 2020, 186, 107909. [Google Scholar] [CrossRef]
- Ahmed, K.; Nizami, S.S.; Riza, N.Z. Reinforcement of natural rubber hybrid composites based on marble sludge/Silica and marble sludge/rice husk derived silica. J. Adv. Res. 2014, 5, 165–173. [Google Scholar] [CrossRef] [PubMed]
- Chawalitsakunchai, W.; Dittanet, P.; Loykulnant, S.; Sae-oui, P.; Tanpichai, S.; Seubsai, A.; Prapainainar, P. Properties of natural rubber reinforced with nano cellulose from pineapple leaf agricultural waste. Mater. Today Commun. 2021, 28, 102594. [Google Scholar] [CrossRef]
- Liu, W.; Hu, D.; Liu, H.; Ma, W. A new reutilization strategy of waste printed circuit board nonmetal powders for constructing superhydrophobic coatings. Polym. Eng. Sci. 2021, 61, 2193–2199. [Google Scholar] [CrossRef]
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content. |
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Share and Cite
Hu, D.; Zeng, X.; Lin, Y.; Chen, Y.; Chen, W.; Jia, Z.; Lin, J. High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules 2023, 28, 6199. https://doi.org/10.3390/molecules28176199
Hu D, Zeng X, Lin Y, Chen Y, Chen W, Jia Z, Lin J. High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules. 2023; 28(17):6199. https://doi.org/10.3390/molecules28176199
Chicago/Turabian StyleHu, Dechao, Xianghong Zeng, Yinlei Lin, Yongjun Chen, Wanjuan Chen, Zhixin Jia, and Jing Lin. 2023. "High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites" Molecules 28, no. 17: 6199. https://doi.org/10.3390/molecules28176199
APA StyleHu, D., Zeng, X., Lin, Y., Chen, Y., Chen, W., Jia, Z., & Lin, J. (2023). High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules, 28(17), 6199. https://doi.org/10.3390/molecules28176199