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Journal: Molecules, 2024
Volume: 29
Number: 4171

Article: First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder
Authors: by Yan Wei, Hua Dai, Li Chen, Xian Wang, Hongzhong Cai, Jiankang Zhang, Ying Xu, Xingqiang Wang, Junmei Guo, Zhentao Yuan and Xiao Wang
Link: https://www.mdpi.com/1420-3049/29/17/4171

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