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Volume 22
Issue 9
10.3390/s22093425
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Communication

High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive

by
Xiuzhu Xu
,
Hao Zhu
,
Shengping Dai
,
Tao Sun
,
Guanggui Cheng
and
Jianning Ding
*
School of Mechanical Engineering, Institute of Intelligent Flexible Mechatronics, Jiangsu University, Zhenjiang 212013, China
*
Author to whom correspondence should be addressed.
Sensors 2022, 22(9), 3425; https://doi.org/10.3390/s22093425
Submission received: 2 April 2022 / Revised: 27 April 2022 / Accepted: 28 April 2022 / Published: 30 April 2022
(This article belongs to the Section Physical Sensors)
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Abstract

With the rapid development of intelligent applications, the demand for high-sensitivity pressure sensor is increasing. However, the simple and efficient preparation of an industrial high-sensitivity sensor is still a challenge. In this study, adhesives with different elastic moduli are used to bond pressure-sensitive elements of double-sided sensitive grids to prepare a highly sensitive and fatigue-resistant pressure sensor. It was observed that the low elastic modulus adhesive effectively produced tensile and compressive strains on both sides of the sensitive grids to induce greater strain transfer efficiency in the pressure sensor, thus improving its sensitivity. The sensitivity of the sensor was simulated by finite element analysis to verify that the low elastic modulus adhesive could enhance the sensitivity of the sensor up to 12%. The preparation of high-precision and fatigue-resistant pressure sensors based on low elastic modulus, double-sided sensitive grids makes their application more flexible and convenient, which is urgently needed in the miniaturization and integration electronics field.
Keywords: adhesives; high sensitivity; low elastic modulus; pressure sensors adhesives; high sensitivity; low elastic modulus; pressure sensors

Share and Cite

MDPI and ACS Style

Xu, X.; Zhu, H.; Dai, S.; Sun, T.; Cheng, G.; Ding, J. High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors 2022, 22, 3425. https://doi.org/10.3390/s22093425

AMA Style

Xu X, Zhu H, Dai S, Sun T, Cheng G, Ding J. High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors. 2022; 22(9):3425. https://doi.org/10.3390/s22093425

Chicago/Turabian Style

Xu, Xiuzhu, Hao Zhu, Shengping Dai, Tao Sun, Guanggui Cheng, and Jianning Ding. 2022. "High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive" Sensors 22, no. 9: 3425. https://doi.org/10.3390/s22093425

APA Style

Xu, X., Zhu, H., Dai, S., Sun, T., Cheng, G., & Ding, J. (2022). High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors, 22(9), 3425. https://doi.org/10.3390/s22093425

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