Xu, X.; Zhu, H.; Dai, S.; Sun, T.; Cheng, G.; Ding, J.
High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors 2022, 22, 3425.
https://doi.org/10.3390/s22093425
AMA Style
Xu X, Zhu H, Dai S, Sun T, Cheng G, Ding J.
High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors. 2022; 22(9):3425.
https://doi.org/10.3390/s22093425
Chicago/Turabian Style
Xu, Xiuzhu, Hao Zhu, Shengping Dai, Tao Sun, Guanggui Cheng, and Jianning Ding.
2022. "High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive" Sensors 22, no. 9: 3425.
https://doi.org/10.3390/s22093425
APA Style
Xu, X., Zhu, H., Dai, S., Sun, T., Cheng, G., & Ding, J.
(2022). High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive. Sensors, 22(9), 3425.
https://doi.org/10.3390/s22093425