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Article

Self-Assembled TiN-Metal Nanocomposites Integrated on Flexible Mica Substrates towards Flexible Devices

by
Juncheng Liu
1,
Yizhi Zhang
1,
Hongyi Dou
1,
Benson Kunhung Tsai
1,
Abhijeet Choudhury
1 and
Haiyan Wang
1,2,*
1
School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA
2
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, USA
*
Author to whom correspondence should be addressed.
Sensors 2024, 24(15), 4863; https://doi.org/10.3390/s24154863
Submission received: 13 May 2024 / Revised: 13 July 2024 / Accepted: 16 July 2024 / Published: 26 July 2024
(This article belongs to the Special Issue Functional Nanomaterials in Sensing)

Abstract

Abstract: The integration of nanocomposite thin films with combined multifunctionalities on flexible substrates is desired for flexible device design and applications. For example, combined plasmonic and magnetic properties could lead to unique optical switchable magnetic devices and sensors. In this work, a multiphase TiN-Au-Ni nanocomposite system with core–shell-like Au-Ni nanopillars embedded in a TiN matrix has been demonstrated on flexible mica substrates. The three-phase nanocomposite film has been compared with its single metal nanocomposite counterparts, i.e., TiN-Au and TiN-Ni. Magnetic measurement results suggest that both TiN-Au-Ni/mica and TiN-Ni/mica present room-temperature ferromagnetic property. Tunable plasmonic property has been achieved by varying the metallic component of the nanocomposite films. The cyclic bending test was performed to verify the property reliability of the flexible nanocomposite thin films upon bending. This work opens a new path for integrating complex nitride-based nanocomposite designs on mica towards multifunctional flexible nanodevice applications.
Keywords: plasmonic; mica; flexible devices; nitride-metal nanocomposite; sensors plasmonic; mica; flexible devices; nitride-metal nanocomposite; sensors

Share and Cite

MDPI and ACS Style

Liu, J.; Zhang, Y.; Dou, H.; Tsai, B.K.; Choudhury, A.; Wang, H. Self-Assembled TiN-Metal Nanocomposites Integrated on Flexible Mica Substrates towards Flexible Devices. Sensors 2024, 24, 4863. https://doi.org/10.3390/s24154863

AMA Style

Liu J, Zhang Y, Dou H, Tsai BK, Choudhury A, Wang H. Self-Assembled TiN-Metal Nanocomposites Integrated on Flexible Mica Substrates towards Flexible Devices. Sensors. 2024; 24(15):4863. https://doi.org/10.3390/s24154863

Chicago/Turabian Style

Liu, Juncheng, Yizhi Zhang, Hongyi Dou, Benson Kunhung Tsai, Abhijeet Choudhury, and Haiyan Wang. 2024. "Self-Assembled TiN-Metal Nanocomposites Integrated on Flexible Mica Substrates towards Flexible Devices" Sensors 24, no. 15: 4863. https://doi.org/10.3390/s24154863

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