Ma, C.; Tian, Y.; Gong, Y.; Zhang, J.; Qi, H.; Wang, C.
Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive. Materials 2018, 11, 1198.
https://doi.org/10.3390/ma11071198
AMA Style
Ma C, Tian Y, Gong Y, Zhang J, Qi H, Wang C.
Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive. Materials. 2018; 11(7):1198.
https://doi.org/10.3390/ma11071198
Chicago/Turabian Style
Ma, Chengkun, Yuan Tian, Yan Gong, Jifeng Zhang, Hui Qi, and Chao Wang.
2018. "Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive" Materials 11, no. 7: 1198.
https://doi.org/10.3390/ma11071198
APA Style
Ma, C., Tian, Y., Gong, Y., Zhang, J., Qi, H., & Wang, C.
(2018). Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive. Materials, 11(7), 1198.
https://doi.org/10.3390/ma11071198