Li, C.; Yan, Y.; Gao, T.; Xu, G.
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder. Materials 2020, 13, 4443.
https://doi.org/10.3390/ma13194443
AMA Style
Li C, Yan Y, Gao T, Xu G.
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder. Materials. 2020; 13(19):4443.
https://doi.org/10.3390/ma13194443
Chicago/Turabian Style
Li, Chaojun, Yanfu Yan, Tingting Gao, and Guodong Xu.
2020. "The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder" Materials 13, no. 19: 4443.
https://doi.org/10.3390/ma13194443
APA Style
Li, C., Yan, Y., Gao, T., & Xu, G.
(2020). The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder. Materials, 13(19), 4443.
https://doi.org/10.3390/ma13194443