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Journal: Materials, 2020
Volume: 13
Number: 4443

Article: The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder
Authors: by Chaojun Li, Yanfu Yan, Tingting Gao and Guodong Xu
Link: https://www.mdpi.com/1996-1944/13/19/4443

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