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Journal: Materials, 2020
Volume: 13
Number: 5497

Article: The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints
Authors: by Xing Fu, Min Liu, KeXin Xu, Si Chen, YiJun Shi, ZhiWei Fu, Yun Huang, HongTao Chen and RuoHe Yao
Link: https://www.mdpi.com/1996-1944/13/23/5497

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