Feng, H.; Zhang, L.; Zhang, J.; Gou, W.; Zhong, S.; Zhang, G.; Geng, H.; Feng, J.
Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials. Materials 2020, 13, 1130.
https://doi.org/10.3390/ma13051130
AMA Style
Feng H, Zhang L, Zhang J, Gou W, Zhong S, Zhang G, Geng H, Feng J.
Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials. Materials. 2020; 13(5):1130.
https://doi.org/10.3390/ma13051130
Chicago/Turabian Style
Feng, Hangbin, Lixia Zhang, Jialun Zhang, Wenqin Gou, Sujuan Zhong, Guanxing Zhang, Huiyuan Geng, and Jicai Feng.
2020. "Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials" Materials 13, no. 5: 1130.
https://doi.org/10.3390/ma13051130
APA Style
Feng, H., Zhang, L., Zhang, J., Gou, W., Zhong, S., Zhang, G., Geng, H., & Feng, J.
(2020). Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials. Materials, 13(5), 1130.
https://doi.org/10.3390/ma13051130