Electrosprayed Chitosan–Copper Complex Microspheres with Uniform Size
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Preparation of Solutions for Electrospraying Process
2.3. Preparation of Chitosan–Metal Complex Microspheres
2.4. Preparation of Buffer Solutions for Stability Study
2.5. Characterization of Chitosan–Cu2+ Solutions
2.6. Characterization of Prepared Microspheres
3. Results and Discussion
3.1. ATR-FTIR Analysis of Microspheres
3.2. The Viscosity of Chitosan and Chitosan–Cu2+ Solutions
3.3. Estimated Size and Shape of Electrosprayed Chitosan–Cu2+ Microspheres
3.4. Morphology of Dried Chitosan–Cu2+ Microspheres
3.5. Volume Ratio of Wet and Dry Microspheres
3.6. Stability Study of Chitosan–Cu2+ Microspheres
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Parameter | Unit | Value |
---|---|---|
Concentration of acetic acid | % | 0.5 |
Initial concentration of chitosan solution | wt.% | 1.2 |
Flow rate of solution | mL h−1 | 5 |
Needle gauge | G | 21 and 23 |
Applied voltage 1 | kV | 14 and 23 |
Dimensions of chamber (length/width/height) | cm | 30/30/25 |
Distance between the needle tip and collector | cm | 10 |
Concentration of NaOH | wt.% | 5 |
Volume of NaOH (collector) | mL | 50 |
Duration of electrospraying | min | 60 |
Temperature (in the chamber) | °C | 28 ± 1 |
Relative humidity (in the chamber) | % | 65 ± 3 |
Sample | Absorption Band/cm−1 | |||||||||
–OH | –NH2 | C–H | Amide I | Amide II | Amide III | C–O–C | –COH | |||
CHT85 | 3362 | 3290 | 2916 | 2872 | 1650 | 1541 | 1336 | 1151 | 1066 | 1030 |
CHT85–Cu0.5 | 3358 | 3289 | 2914 | 2873 | 1650 | 1542 | * | 1150 | 1061 | 1025 |
CHT85–Cu5 | 3354 | 3282 | 2924 | 2873 | 1648 | 1542 | 1337 | 1151 | 1056 | 1020 |
CHT95 | 3359 | 3292 | 2919 | 2872 | 1650 | 1541 | 1336 | 1151 | 1065 | 1029 |
CHT95–Cu0.5 | 3363 | 3290 | 2921 | 2874 | 1651 | 1541 | 1339 | 1150 | 1061 | 1027 |
CHT95–Cu5 | 3361 | 3275 | 2920 | 2873 | 1649 | 1541 | 1339 | 1151 | 1056 | 1021 |
Sample | η/mPa s | Sample | η/mPa s |
---|---|---|---|
CHT85 | 90.1 ± 0.1 | CHT95 | 24.1 ± 0.1 |
CHT85–Cu0.5 | 59.5 ± 0.2 | CHT95–Cu0.5 | 17.8 ± 0.1 |
CHT85–Cu1 | 59.6 ± 0.4 | CHT95–Cu1 | 16.7 ± 0.1 |
CHT85–Cu5 | 38.6 ± 0.1 | CHT95–Cu5 | 15.0 ± 0.1 |
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Lončarević, A.; Ivanković, M.; Rogina, A. Electrosprayed Chitosan–Copper Complex Microspheres with Uniform Size. Materials 2021, 14, 5630. https://doi.org/10.3390/ma14195630
Lončarević A, Ivanković M, Rogina A. Electrosprayed Chitosan–Copper Complex Microspheres with Uniform Size. Materials. 2021; 14(19):5630. https://doi.org/10.3390/ma14195630
Chicago/Turabian StyleLončarević, Andrea, Marica Ivanković, and Anamarija Rogina. 2021. "Electrosprayed Chitosan–Copper Complex Microspheres with Uniform Size" Materials 14, no. 19: 5630. https://doi.org/10.3390/ma14195630