A Method and Device for Automated Grinding of Small Ceramic Elements
Abstract
:1. Introduction
2. Materials and Methods
2.1. Purpose and Scope of Research
- The use of a very small thickness of the layers of material removed with individual grains allows to significantly reduce the local values of the process energy, which allows more favorable features of the surface layer after treatment to be obtained.
- The small depth of grinding results in a low density of heat fluxes, a short time of their local impact, and small temperature gradients. The depth of heat penetration into the surface layer of the object is significantly reduced.
- The use of small layers of material removal reduces grinding forces, which is important for machining small-size and high compliance workpieces or workpieces with low thickness and low pressure resistance.
- The use of low material removal rates does reduce the proportion of active grains, but it is compensated by the considerable elongation of the grinding zone resulting from the features of the method.
- Automated grinding of small ceramics can be competitive with lapping processes by increasing productivity, eliminating stacking of items on lapping plates, increasing production flexibility, and extending process monitoring.
- To obtain a long grinding zone and a decreasing speed of stock removal during the movement of the object under the active surface of the grinding wheel, it was assumed that:
- The machining will be carried out on an angular path ϕmax with the use of grinding wheels with radius Rg and with a hyperboloid active surface, and the lowest-lying forming (cross-section A-A) will be horizontal (cross-section B-B). The axis of the grinding wheel deviates from the plane of movement of the objects by angles α and β (Figure 1).
- The machining cycle consists of a single pass of the ground elements through several treatment zones.
- In the grinding process, up to five grinding wheels (Figure 2) with diamond grains, joined by a metal bond to form aggregates with dimensions of approx. 500 µm, will be used. Due to the developed surface, the aggregates were placed in resin binders ensuring high porosity. As a result, the bonding forces of the grains are high, the porosity is good, and the low temperatures in the production of grinding wheels do not limit the introduction of active additives into the volume of the abrasive tools.
- The allowance removed by subsequent grinding wheels has been divided taking into account the safe relationship between the pressure force on the workpiece and its compressive strength.
2.2. Characteristics of Processed Elements As Well As Parameters and Processing Conditions
2.3. Research Stand
2.4. Methodology of Optimizing the Division of the Allowance in the Process of Sequential Grinding of Small Ceramic Elements
3. Results
Research on Grinding Processes
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Formula | CaCO3 | TiO2 | Parafin Emulsion | ZrO2 | Other Admixtures |
---|---|---|---|---|---|
share | 50% | 40% | 7% | 1% | 2% |
Aggregate Grinding Wheel Hardness | Size of Diamond Grains, µm | Concentration | Average Linear Aggregate Size aavg, µm | Average Distance between the Centers of the Aggregates laavg, µm | Percentage of Aggregates in the Volume of the Abrasive Layer, % | Unit Number of Aggregates, 1/cm2 |
---|---|---|---|---|---|---|
H | 160/125 | 75 | 540 | 1457.4 | 34.5 | 50 |
K | 160/125 | 75 | 516 | 1444.1 | 33.2 | 50.4 |
Size of Diamond Grains, µm | Number of Grains in One Carat | Concentration | Unit Volume Number of Grains z, 1/cm3 | Unit Linear Number of Grains z1, 1/cm | Distance Between the Grains on the Active Surface lzavg, µm | Distance Between the Grains in the Volume of the Abrasive Layer lzoavg, µm |
---|---|---|---|---|---|---|
160/125 | 25,500 | 75 | 84,150 | 44 | 227 | 321 |
No. | Grain Size, µm | Angle α, ° | The Height of the Element after Processing, mm | Removal of Allowance, mm |
---|---|---|---|---|
1. | 160–125 | 0°35′ | 1.57 | 0.03–0.23 |
2. | 125–100 | 0°35′ | 1.35 | 0.22 |
3. | 125–100 | 0°35′ | 1.13 | 0.22 |
4. | 100–80 | 0°25′ | 1.05 | 0.08 |
5. | 63–50 | 0° | 1.00 | 0.05 |
Parameter | Value |
---|---|
Diameter of ground elements | 7.4−0.2 mm |
Height of elements after grinding | 0.98±0.02 mm |
Machining efficiency—elements/h | 1280–6800 |
Table rotation speed | 0.066–0.175 min−1 |
Table diameter | 1060 mm |
Speed of moving objects | 4–20 mm/s |
Number of locating sockets | 324 |
Number of grinding headstocks | 5 |
Spindle speed | 2820 min−1 |
Diameter of the diamond grinding wheels | 200 mm |
Vertical spindle travel | up to 10 mm |
Elementary plot on the scale of vertical spindle travel | 0.001 µm |
Compressed air supply pressure | min. 0.2 MPa |
Compressed air flow rate | 10 m3/min |
Water supply pressure | min. 0.2 MPa |
Water flow rate | 3 dm3/min |
Supply voltage/frequency | 3 × 380 V/50 Hz |
Drive motor power of each grinding wheel | 0.75 kW |
Table drive motor power | 0.37 kW |
Total, installed power | 4.48 kW |
Overall dimensions A × B × H | 1500 mm × 1700 mm × 1290 mm |
The mass of the device | about 1100 kg |
Headstock Number | Safe Parameters | Element with a Height | ||
---|---|---|---|---|
Minimal (ac = 100 µm) | Average (ac = 200 µm) | Maximal (ac = 300 µm) | ||
1–3 | vw, mm/s | 8.5 | 5.9 | 4.4 |
1 | a1, µm | 64.2 | 103.7 | 139.1 |
Fn1, N | 32.5 | 31.4 | 30.4 | |
2 | a2, µm | 29.7 | 67.5 | 100.6 |
Fn2, N | 29.8 | 29.9 | 28.7 | |
3 | a3, µm | 6.1 | 28.7 | 60.3 |
Fn3, N | 22.3 | 23.3 | 24.1 |
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Kacalak, W.; Lipiński, D.; Szafraniec, F.; Bałasz, B. A Method and Device for Automated Grinding of Small Ceramic Elements. Materials 2021, 14, 7904. https://doi.org/10.3390/ma14247904
Kacalak W, Lipiński D, Szafraniec F, Bałasz B. A Method and Device for Automated Grinding of Small Ceramic Elements. Materials. 2021; 14(24):7904. https://doi.org/10.3390/ma14247904
Chicago/Turabian StyleKacalak, Wojciech, Dariusz Lipiński, Filip Szafraniec, and Błażej Bałasz. 2021. "A Method and Device for Automated Grinding of Small Ceramic Elements" Materials 14, no. 24: 7904. https://doi.org/10.3390/ma14247904
APA StyleKacalak, W., Lipiński, D., Szafraniec, F., & Bałasz, B. (2021). A Method and Device for Automated Grinding of Small Ceramic Elements. Materials, 14(24), 7904. https://doi.org/10.3390/ma14247904