Article Versions Notes

Xu K, Fu X, Wang X, Fu Z, Yang X, Chen S, Shi Y, Huang Y, Chen H. The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration. Materials. 2022; 15(1):108. https://doi.org/10.3390/ma15010108

Xu, Kexin, Xing Fu, Xinjie Wang, Zhiwei Fu, Xiaofeng Yang, Si Chen, Yijun Shi, Yun Huang, and Hongtao Chen. 2022. "The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration" Materials 15, no. 1: 108. https://doi.org/10.3390/ma15010108

Xu, K., Fu, X., Wang, X., Fu, Z., Yang, X., Chen, S., Shi, Y., Huang, Y., & Chen, H. (2022). The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration. Materials, 15(1), 108. https://doi.org/10.3390/ma15010108