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Journal: Materials, 2022
Volume: 15
Number: 7965

Article: Bond Stress–Slip Model of BFRP Grid to ECC
Authors: by Langni Deng, Taisheng Li, Mengjun Zhong, Ling Liao and Hua Li
Link: https://www.mdpi.com/1996-1944/15/22/7965

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