Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications
Abstract
:1. Introduction
2. Raw Materials and Their Data Sheets
3. Sample Preparation
4. Fabry-Perot Open Resonator (FPOR)
4.1. FPOR Measurement Results of Vendor 1
4.2. FPOR Measurement Results of Vendor 2
4.3. FPOR Measurement Results of Vendor 3
4.4. Comparison between the Measurement Results from Vendors
5. Test Vehicle Designed by Polar and ANSYS
5.1. Test Vehicle Designed by Polar
5.2. Test Vehicle Verified by ANSYS
6. Test Vehicles Fabrication
7. TDR Measurement and Results
8. Effective Dielectric Constant (Ɛeff)
9. VNA Measurement and Correlation with Simulation Results
9.1. VNA Measurements
9.2. Correlation of VNA Measurements with ANSYS Simulations
10. Summary
- ➢
- A systematic approach and complete flow to characterize the electrical performance (from 1 GHz to 40 GHz) of low-loss insulation materials by utilizing the FPOR, simulation, and S-parameter measurement have been provided. The Dk and Df of low-loss dielectric materials have been measured by the FPOR technique and, based on the IEC 61189:2015, a sample preparation produced. These values compared very well with those from the data sheets of the raw materials. It has been found that: (a) the BCB and PPE samples have a better performance in terms of the electrical material properties (Dk and Df) and repeatability; (b) the PI sample has the worst repeatability and electrical material properties; and (c) the Dk and Df measurement results are affected by environment, measuring instrument, and sample fabrication flow.
- ➢
- Based on Polar and ANSYS’ HFSS, a CPWG test vehicle was designed and fabricated. The impedance of the test vehicle was measured by TDR, and the effective Dk of the test vehicle was calculated through a closed-form equation and the real dimensions of the metal line width, spacing, and thickness of the fabricated test vehicle. The insertion loss and return loss of the test vehicle were measured by VNA, and their trends and values correlated very well with the ANSYS’ HFSS simulation results based on the real dimension of the fabricated test vehicle. It was found that the thickness of the dielectric material (PID) plays a very important role in the electrical performance, such as the insertion loss and return loss. Thus, controlling the thickness of the PID is a very critical process step during manufacturing.
- ➢
- The systematic approach to design, measurement, and simulation presented herein could be useful in design and/or manufacturing for high-speed and high-frequency applications.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
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Items | Company | ||||
---|---|---|---|---|---|
Vendor 1 | Vendor 2 | Vendor 3 | |||
Type | - | BCB | PPE | PI | |
Tone | - | Negative | |||
Curing | Temperature | °C | 170/200 | 200 | 230 |
Time | min | 60/60 | - | - | |
Developer | PGMEA | PGMEA | - | ||
Electrical Properties | Dielectric constant (Dk) | 2.66, 2.64 | 2.48, 2.57 | 3.07, 3.11, 2.9 | |
Dissipation factor (Df) | 0.0031, 0.0032 | 0.003, 0.003 | 0.01, 0.01, 0.01 | ||
Frequency (GHz) | 28.3, 39.6 | 28, 40 | 19.36, 29.1, 38.9 | ||
Physical Properties | (<Tg) | ppm/K | 31 | 60 | - |
Tg | °C | 170 | 215 | - | |
Moisture absorption | % | 0.17 (23 °C/45%RH) | 0.03 (23 °C/85%RH) | 2.23 (23 °C/80%RH) | |
Residual stress | MPa | 20 @ 23 °C | 14 | - | |
5% weight loss temp. | °C | 340 | 413 @ N2 | 340 | |
Mechanical Properties | Young’s modulus | GPa | 2.4 | 1.6 | 3.9 |
Elongation (RT) | % | 13 | 35 | 62 | |
Tensile strength | Mpa | 84 | 60 | 197 | |
Poisson’s ratio | - | 0.36 | - | - |
Form | Vendor 1 | Vendor 2 | Vendor 3 | |
---|---|---|---|---|
Type | - | BCB | PPE | PI |
Raw Material | Liquid | |||
Sample (Film) | Prapared by Unimicron | 10 cm × 10 cm × 28 µm (UMTC 1) | 10 cm × 10 cm × 57 µm (UMTC 2) | 10 cm × 10 cm × 17 µm (UMTC 3) |
Prepared by Vendor | 10 cm × 10 cm × 18 µm (Vendor 1) | 10 cm × 10 cm × 30 µm (Vendor 2) | NA |
Samples/ Data Sheet | Frequency | |||||||
---|---|---|---|---|---|---|---|---|
21.3 | 25.5 | 28.2 | 32.4 | 35.2 | 38 | 40.7 | ||
Dk | UMTC 1 (Sample) | 2.56 | 2.53 | 2.51 | 2.49 | 2.48 | 2.46 | 2.44 |
Vendor 1 (Sample) | 2.67 | 2.66 | 2.65 | 2.65 | 2.64 | 2.62 | 2.62 | |
Vendor 1 (Data sheet) | NA | NA | 2.66 (28.3 GHz) | NA | NA | 2.64 (39.6 GHz) | NA | |
Df | UMTC 1 (Sample) | 0.0025 | 0.0033 | 0.0030 | 0.0029 | 0.0029 | 0.0034 | 0.0043 |
Vendor 1 (Sample) | 0.0016 | 0.0032 | 0.0033 | 0.0026 | 0.0041 | 0.0030 | 0.0035 | |
Vendor 1 (Data sheet) | NA | NA | 0.0031 (28.3 GHz) | NA | NA | 0.0032 (39.6 GHz) | NA |
Samples/ Data Sheet | Frequency (GHz) | |||||||
---|---|---|---|---|---|---|---|---|
21.3 | 25.5 | 28.2 | 32.4 | 35.2 | 38 | 40.7 | ||
Dk | UMTC 2 (Sample) | 2.47 | 2.47 | 2.47 | 2.45 | 2.53 | 2.47 | 2.47 |
Vendor 2 (Sample) | 2.58 | 2.58 | 2.59 | 2.6 | 2.61 | 2.62 | 2.615 | |
Vendor 2 (Data sheet) | NA | NA | 2.48 (28 GHz) | NA | NA | NA | 2.57 (40 GHz) | |
Df | UMTC 2 (Sample) | 0.0025 | 0.0026 | 0.0025 | 0.0025 | 0.0025 | 0.0026 | 0.0030 |
Vendor 2 (Sample) | 0.0016 | 0.0025 | 0.0028 | 0.0025 | 0.0034 | 0.0028 | 0.0032 | |
Vendor 2 (Data sheet) | NA | NA | 0.003 (28.3 GHz) | NA | NA | NA | 0.003 (40 GHz) |
Samples/ Data Sheet | Frequency (GHz) | |||||||
---|---|---|---|---|---|---|---|---|
21.3 | 25.5 | 28.2 | 32.4 | 35.2 | 38 | 40.7 | ||
Dk | UMTC 3 (Sample) | 3.26 | 3.25 | 3.24 | 3.23 | 3.20 | 3.23 | 3.23 |
Vendor 3 (Data sheet) | 3.07 (19.36 GHz) | NA | 3.11 (29.1 GHz) | NA | NA | NA | 2.9 (38.9 GHz) | |
Df | UMTC 3 (Sample) | 0.0119 | 0.0121 | 0.0127 | 0.0125 | 0.0122 | 0.0129 | 0.0136 |
Vendor 3 (Data sheet) | 0.01 (19.36 GHz) | NA | 0.01 (29.1 GHz) | NA | NA | NA | 0.01 (38.9 GHz) |
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Lee, T.-N.; Lau, J.-H.; Ko, C.-T.; Xia, T.; Lin, E.; Yang, K.-M.; Lin, P.-B.; Peng, C.-Y.; Chang, L.; Chen, J.-S.; et al. Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications. Materials 2022, 15, 2396. https://doi.org/10.3390/ma15072396
Lee T-N, Lau J-H, Ko C-T, Xia T, Lin E, Yang K-M, Lin P-B, Peng C-Y, Chang L, Chen J-S, et al. Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications. Materials. 2022; 15(7):2396. https://doi.org/10.3390/ma15072396
Chicago/Turabian StyleLee, Tzu-Nien, John-H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Kai-Ming Yang, Puru-Bruce Lin, Chia-Yu Peng, Leo Chang, Jia-Shiang Chen, and et al. 2022. "Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications" Materials 15, no. 7: 2396. https://doi.org/10.3390/ma15072396