Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions
Abstract
:1. Introduction
2. Board-Level Thermal Cycling Tests
2.1. Test Vehicle Structure
2.2. Thermal Cycling Tests
2.3. Thermal Cycling Test Results
3. Coupled Mechanical Compression and Thermal Cycling Simulation
3.1. Finite-Element Modeling
3.2. Material Properties
3.3. Verification of Simulation Model
3.4. Solder Joint Reliability Analysis
3.5. Effects of Heat Sink
4. Conclusions
- The board-level TCT results have shown that fracture occurs at the outermost corner solder ball joint in the BGA irrespective of whether or not a heat sink is attached to the package. However, the severity of the solder ball cracking increases under the additional load imposed by the heat sink. Consequently, the number of cycles to first failure is significantly reduced.
- The CSED within the solder balls at the outermost corners of the BGA increases with both the addition of the heat sink to the FCBGA assembly and an increasing distance of the loading force position from the center of the heat sink. A greater loading distance increases the compressive force acting on the BGA as the result of the bending moment, and is thus detrimental to the TCT reliability of the FCBGA assembly.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Package size (mm) | 40 × 40 |
Die size (mm) | 15.5 × 15.5 × 0.78 |
Substrate thickness (mm) | 1.2 |
Underfill thickness (μm) | 25 |
Sample | Cycles to First Failure | |
---|---|---|
W/O Heat Sink | W/Heat Sink | |
1 | 3652 | 2694 |
2 | 3689 | 2496 |
3 | 3865 | 2587 |
Component | E (GPa) | CTE (ppm/°C) | Tg (°C) | ν |
---|---|---|---|---|
Die | 131 | 2.8 | - | 0.30 |
Solder mask | 2.7 | 50/140 | 100 | 0.30 |
Underfill | Figure 12 | 32/110 | 70 | 0.30 |
Substrate | Figure 12 | X/Y: 23.46 Z: 52.65/156.4 | 156 | 0.30 |
Test board | X/Y: C0 = 27.924, C1 = −0.0372 Z: C0 = 12.203, C1 = −0.016 | X/Y: 16.5 Z: 67.2 | - | 0.39 |
Solder Ball | 48.5@-55 °C 33@210 °C | 20 | - | 0.35 |
TIM | 0.0083 | 14 | - | 0.35 |
Heat spreader | 68 | 24 | - | 0.344 |
Constant | Unit | Value |
---|---|---|
C1 | S−1 | 277,984 |
C2 | MPa−1 | 0.02447 |
C3 | n | 6.41 |
C4 | K | 6489.7 |
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Shih, M.-K.; Liu, Y.-H.; Lee, C.; Hung, C.P. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions. Materials 2023, 16, 4291. https://doi.org/10.3390/ma16124291
Shih M-K, Liu Y-H, Lee C, Hung CP. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions. Materials. 2023; 16(12):4291. https://doi.org/10.3390/ma16124291
Chicago/Turabian StyleShih, Meng-Kai, Yu-Hao Liu, Calvin Lee, and C. P. Hung. 2023. "Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions" Materials 16, no. 12: 4291. https://doi.org/10.3390/ma16124291
APA StyleShih, M. -K., Liu, Y. -H., Lee, C., & Hung, C. P. (2023). Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions. Materials, 16(12), 4291. https://doi.org/10.3390/ma16124291