Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
Abstract
:1. Introduction
2. Experimental Materials and Methods
2.1. Materials
2.2. Soldering Test
2.3. Electromigration Device Design, Manufacturing, and Testing
2.4. Test Scheme and Test Method
3. Results
3.1. Microstructure of Solder Joints without Current Loading
3.2. Microstructure of Solder Joints during Current Loading
3.2.1. Impact of Current Density
3.2.2. Impact of the Current Loading Process
3.3. Interfacial Reaction Analysis in Electromigration of Solder Joints
3.4. Mechanical Properties and Fracture Mechanism of the Electromigration of Solder Joints
3.4.1. Electrical and Mechanical Properties
3.4.2. Mechanical Fracture Mechanism
4. Conclusions
- (1)
- With the ideal self−designed and manufactured electromigration device, Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder joints show evidence of typical electromigration polarity under the conditions of a typical electromigration polarity ≥ 7 × 103 A/cm2 and included angle between the c−axis of the β−Sn grains and the current direction θ ≤ 53.2°. The anode−side interfacial IMC of the solder joints is dominated by a Cu6Sn5 phase, has a gradually increasing thickness, forms a Cu3Sn phase, and shows evidence of microcracks. The Cu6Sn5 phase of the cathode−side interfacial IMC is gradually completely dissolved, and the growth of the Cu3Sn phase is accompanied by the formation of Kirkendall voids.
- (2)
- The anisotropic diffusion of Cu atoms in β−Sn in the electromigration of Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder points affects four stages of electromigration: the incubation stage, expansion stage, stability stage, and failure stage. The process of electromigration can be decelerated through the reasonable adjustment and control of θ.
- (3)
- In the four stages of electromigration of Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder joints, the increase in the resistance is inversely correlated with the decrease in the shear strength, and the solder joints reach the failure state at 250 h. The shear fracture path of the solder joints moves from the cathode side near the IMC solder seam to the Cu3Sn interface. The shear fracture mechanism changes from ductile transgranular fracture dominated by β−Sn dimples to brittle fracture dominated by interfacial IMC cleavage and slip steps.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Area | Sn | Ag | Cu |
---|---|---|---|
A | 93.82 | 2.41 | 3.77 |
B | 56.69 | 2.87 | 40.44 |
C | 44.92 | 1.69 | 53.39 |
D | 28.67 | 1.07 | 70.26 |
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Zhang, C.; Zhang, K.; Gao, Y.; Wang, Y. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints. Materials 2023, 16, 2626. https://doi.org/10.3390/ma16072626
Zhang C, Zhang K, Gao Y, Wang Y. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints. Materials. 2023; 16(7):2626. https://doi.org/10.3390/ma16072626
Chicago/Turabian StyleZhang, Chao, Keke Zhang, Yijie Gao, and Yuming Wang. 2023. "Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints" Materials 16, no. 7: 2626. https://doi.org/10.3390/ma16072626