Article Versions Notes

Yao J, Li C, Shang M, Chen X, Wang Y, Ma H, Ma H, Liu X. Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction. Materials. 2024; 17(15):3682. https://doi.org/10.3390/ma17153682

Yao, Jinye, Chenyu Li, Min Shang, Xiangxu Chen, Yunpeng Wang, Haoran Ma, Haitao Ma, and Xiaoying Liu. 2024. "Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction" Materials 17, no. 15: 3682. https://doi.org/10.3390/ma17153682

Yao, J., Li, C., Shang, M., Chen, X., Wang, Y., Ma, H., Ma, H., & Liu, X. (2024). Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction. Materials, 17(15), 3682. https://doi.org/10.3390/ma17153682