Zheng, X.; Zheng, K.; Gao, J.; Wang, Y.; An, P.; Ma, Y.; Hei, H.; Qu, S.; Yu, S.
Synergistic Multi-Mechanism Enhancement in Chemomechanical Abrasive Polishing of Polycrystalline Diamond via a New SiO2–Diamond Slurry in High-Concentration H2O2 Solution. Materials 2025, 18, 3659.
https://doi.org/10.3390/ma18153659
AMA Style
Zheng X, Zheng K, Gao J, Wang Y, An P, Ma Y, Hei H, Qu S, Yu S.
Synergistic Multi-Mechanism Enhancement in Chemomechanical Abrasive Polishing of Polycrystalline Diamond via a New SiO2–Diamond Slurry in High-Concentration H2O2 Solution. Materials. 2025; 18(15):3659.
https://doi.org/10.3390/ma18153659
Chicago/Turabian Style
Zheng, Xin, Ke Zheng, Jie Gao, Yan Wang, Pengtao An, Yongqiang Ma, Hongjun Hei, Shuaiwu Qu, and Shengwang Yu.
2025. "Synergistic Multi-Mechanism Enhancement in Chemomechanical Abrasive Polishing of Polycrystalline Diamond via a New SiO2–Diamond Slurry in High-Concentration H2O2 Solution" Materials 18, no. 15: 3659.
https://doi.org/10.3390/ma18153659
APA Style
Zheng, X., Zheng, K., Gao, J., Wang, Y., An, P., Ma, Y., Hei, H., Qu, S., & Yu, S.
(2025). Synergistic Multi-Mechanism Enhancement in Chemomechanical Abrasive Polishing of Polycrystalline Diamond via a New SiO2–Diamond Slurry in High-Concentration H2O2 Solution. Materials, 18(15), 3659.
https://doi.org/10.3390/ma18153659
