Rahul, N.; Park, B.; Pradhan, S.K.; Sung, H.-E.; Jeong, I.-H.; Yun, Y.-S.; Oh, M.-S.
Scalable Engineering of Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance by Combined Nanostructuring and Chemical Vapor Deposition. Materials 2025, 18, 3981.
https://doi.org/10.3390/ma18173981
AMA Style
Rahul N, Park B, Pradhan SK, Sung H-E, Jeong I-H, Yun Y-S, Oh M-S.
Scalable Engineering of Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance by Combined Nanostructuring and Chemical Vapor Deposition. Materials. 2025; 18(17):3981.
https://doi.org/10.3390/ma18173981
Chicago/Turabian Style
Rahul, N., Beomguk Park, Sanjaya Kumar Pradhan, Ho-Eon Sung, Inn-Hyup Jeong, Yong-Sup Yun, and Min-Suk Oh.
2025. "Scalable Engineering of Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance by Combined Nanostructuring and Chemical Vapor Deposition" Materials 18, no. 17: 3981.
https://doi.org/10.3390/ma18173981
APA Style
Rahul, N., Park, B., Pradhan, S. K., Sung, H.-E., Jeong, I.-H., Yun, Y.-S., & Oh, M.-S.
(2025). Scalable Engineering of Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance by Combined Nanostructuring and Chemical Vapor Deposition. Materials, 18(17), 3981.
https://doi.org/10.3390/ma18173981