3.1. Pyrolysis Time Effect on Composition Separation and Domain Formation
There are two common observations for the pyrolyzing systems in this study. The first one is related to atomic species. After the precursor systems reach a specific pyrolysis temperature of 1500 K, 1800 K, or 2100 K, there are still plenty of H atoms present, indicating that the actual pyrolysis temperature is still relatively low, even though the simulation temperature has reached as high as 2100 K. From a different perspective, it also means that H atoms are difficult to remove from the SiOC systems. Even though H atoms are often ignored in experimental studies [
8,
30,
31,
32,
33,
34,
35] due to its low atomic weight and the difficulty of quantification, hydrogen species can persist in the pyrolyzed systems until high temperatures, at least up to 1200 °C. Thus, H atoms are present throughout all the pyrolysis runs in this study. The second observation is related to the atomic structures. At the beginning of the peak holding temperature, all the pyrolyzed ceramic systems are largely homogeneous. With the pyrolysis time increase, the simulation shows that Si-O clusters start to separate from the C clusters. In general, longer pyrolysis time leads to more Si-O and C cluster separation. MD simulations, in general, can only simulate processes in the nanoseconds or a shorter time. When we simulate SiOC systems with ~1M atoms, a few nanoseconds can take several weeks. The only experimental condition that can be compared with is heating by some short pulse laser. In the actual systems, we expect a continuation of the cluster separation process with typical pyrolysis.
Specifically, the atomic structural evolution for the PVMS system at 2100 K simulation temperature is shown in
Figure 2 at different times. The lower pyrolysis temperatures of 1500 K and 1800 K show a similar trend but to a lesser extent as given in the supplement (
Figure S1 for the 1800 K simulation results). The supplement also provides the atomic structural evolution results for PDMS (
Figures S2–S4), PDES (
Figures S5–S7), and PMPS (
Figures S8 and S9) at different pyrolysis temperatures. In
Figure 2a, the small green species are H atoms, which bond with C atoms (yellow) only. O (blue) atoms bond with Si (red) atoms with short strands resembling the Si-O linear chains in the initial polymer precursor. C atoms (yellow) bond with Si atoms, inherited from the initial polymer precursor structure, since C atoms are from the vinyl and methyl side groups. Some C species are separated from the Si species. With the simulation time increase to 0.5 ns (
Figure 2b), Si-O species grow and form clusters with some remaining short Si-O strands, C-Si bonds decrease, and C atoms detach from Si atoms and form duplets or exist individually. Some C and H atoms are bonded with the C atoms from above or below the plane at display. At 1.0 ns simulation time (
Figure 2c), the Si-O clusters continue to grow, with an observable amount of C atoms enclosed in the Si-O clusters. Away from the Si-O clusters, C atoms start to form duplets or triplets. Some O atoms are bonded to the C atoms, which means some gaseous species are forming. Some Si atoms are also bonded with C atoms, which means that the C side group separation is not complete. At 1.5 ns simulation time (
Figure 2d), the results indicate that the Si-O clusters continue to grow in size and decrease in numbers. C duplets, triplets, and quadruplets continue to increase as a result of H removal and new C-C bond formation. Some O atoms are still bonded with C atoms, indicating continuous gaseous species formation, possibly as CO or CO
2. Si-C bonds are very few, meaning almost complete C side group separation from the Si-O backbone. Also, the amount of C atoms in the Si-O rich clusters decreases, further indicating the C side group separation from the Si-O backbone. At 2.0 ns simulation time (
Figure 2e), the simulation shows that only one large Si-O cluster is observed. In the C-rich regions, there are some C-O bonds and a few Si-C bonds. The Si-O rich cluster has very few C species. This atomic structure evolution indicates that Si-O bonds mostly separate from C atoms to form SiO
x clusters. Simultaneously, C atoms form amorphous C or even graphitic C. Some CO gas forms besides hydrocarbon species. There is a very limited number of Si-C duplets.
Bond fraction, representing the bond number for a specific type to the total number of bonds in the system, evolves dynamically with temperature. In this work, bonds are defined based on atomic proximity and bonding criteria derived from the ReaxFF potential, which allows for reactive bond-breaking and bond-forming events to be captured accurately [
26,
27]. The bond types analyzed include Si-O, Si-Si [
36,
37], Si-C, and C-C, representing key interactions in the system during pyrolysis.
Figure 3 shows the changes in the Si-related and C-related bond fractions with the simulation time at 2100 K. The Si-O bond has the highest content, varying from 0.43 to 0.49 (in bond fraction). There is an increase and then a slight decrease due to the changes in other bonds, especially the Si-C bond decrease, which is most drastic and decreases from 0.40 to 0.10 from 0 ns to 2.0 ns of simulation time. The simulation indicates that this Si-C bond decrease is a direct result of the methyl and vinyl group separation from the Si-O backbone. At the same time, the C-C bond fraction steadily increases from 0.17 to 0.27. Collectively, this means that the C-side group decomposition from the Si-O backbone leads to C-rich regions. Also, the Si-Si bond content steadily increases from 0 to 0.19 as the simulation time increases from 0 to 2.0 ns. The Si-Si bond formation is a new observation in the ReaxFF simulation, in this work and our earlier studies [
26,
27,
28,
38]. One explanation is that the Si-O clusters are highly active after the C side group separation. The Si-O backbone species have a high tendency to bond among themselves and reduce the system energy. When O atoms are absent from the surrounding regions or Si-O bonds are configurationally unfavorable, Si-Si bond forms. The Si-O bond energy is ~780–785 kJ/mol. The Si-Si bond energy is approximately 208–213 kJ/mol. The Si-Si bond is measured at 2.46 Å and in the second-nearest-neighbor, indicating the large proximity of Si atoms to each other. Thus, Si-Si is a weaker bond, but they can still form when O is absent.
3.2. Pyrolysis Temperature Effect
Pyrolysis temperature has a similar effect on the SiOC atomic structure evolution as the simulation time by affecting bond energies. For example, Si-H (~300–305 kJ/mol) and Si-C (~417–422 kJ/mol) have very different bond energy compared to that of Si-O bond (~780–785 kJ/mol) bonds [
39,
40,
41]. The weaker Si–H and Si-C bonds break more readily, leading to the release of hydrocarbons and the separation of C from SiO
x phases. In contrast, the Si–O bond, being significantly stronger, remains stable and contributes to the formation of Si-O clusters. A higher pyrolysis temperature leads to more Si-O and C domain separation, even though the extent varies, depending on the specific precursor system. To illustrate the specific changes, PDES is used as an example as shown in
Figure 4. After 2 ns simulation time at 1500 K (
Figure 4a), some Si-O clusters form and grow from being strand-like to being equiaxed. C-rich domains can be observed (red circles in
Figure 4a). However, there is no large domain separation. Some Si-O clusters are still bonded to C species. At 1800 K simulation, Si-O clusters and C domains separate cleanly. There is no Si in the C domain, which has grown into a large region. Only very few O atoms are still bonded to C (as highlighted by the two small orange circles in
Figure 4b). There are no C atoms in the Si-O clusters. With the simulation temperature increase to 2100 K (
Figure 4c,d), almost complete Si-O separation from C occurs. Depending on the slicing plane in the 3D simulation volume, almost pure Si-O domains (
Figure 4c) or pure C domains (
Figure 4d) may be obtained.
Figure 4c shows mostly Si-O clusters with a small number of C atoms scattered in between. Slicing farther into the Si-O cluster domain can result in pure Si-O compositions. In
Figure 4d, it is mostly C species with a few Si-O clusters. The simulation also shows that a small amount of O atoms continues to bond with the C species. Again, slicing farther into the C cluster domain can result in pure C composition.
Different bond fractions evolve simultaneously with the simulation temperature for the PDES system (
Figure 5), which is also the case for the other systems. As shown in
Figure 5a, with the pyrolysis time increase, the Si-O bond fraction consistently increases. The pyrolysis temperature significantly affects the degree of increase. At 1500 K pyrolysis temperature, the Si-O bond fraction gradually increases, from 0.33 to 0.37, which means that other bonds in the pyrolyzing system are largely present. At 1800 K pyrolysis temperature, the Si-O bond fraction remains steady at 0.33 from 0 to 0.5 ns simulation time and then quickly increases from 0.34 to 0.52. Obviously, a higher pyrolysis temperature of 1800 K is causing drastic changes in Si-C bond, C-C bond, and Si-Si bond. At 2100 K pyrolysis temperature, the Si-O bond fraction quickly increases from 0.33 to 0.59 and then stabilizes at 0.59. This means that 2100 K pyrolysis temperature can cause significant Si-C bond breaking and Si-O bond re-formation during pyrolysis. After the bonds re-form, they remain stable.
Figure 5b shows the Si-C bond fraction changes with the simulation time at different pyrolysis temperatures. In all cases, the Si-C bond fraction decreases with the pyrolysis time, demonstrating the C side group separation from the Si-O backbone. At 1500 K, the Si-C bond fraction decreases slightly from 0.34 to 0.28, due to the lower pyrolysis temperature. At 1800 K, the Si-C bond fraction decreases significantly from 0.34 to 0.065 after a slight decrease in the early period of the holding time. At 2100 K, the Si-C bond fraction decreases significantly starting from 0.34 to 0.022 and then stabilizes at 0.024. The Si-C bond fraction changes are the opposite of what has been observed for the Si-O bond (
Figure 5a). This is as expected since the Si-C bond fraction decrease is being compensated for by the Si-O bond fraction increase.
Figure 5c shows the C-C bond fraction change with the simulation time at different pyrolysis temperatures. Surprisingly, there is a C-C bond fraction decrease at all the simulation temperatures. Longer simulation time leads to more C-C bond fraction decrease. In combination with
Figure 5b, it means that the separated C side group does not form C-C bonds or domains. Instead, it indicates that the hydrocarbon species have escaped from the pyrolyzing system. This change is especially obvious at higher pyrolysis temperatures. The specific changes can be correlated with the gas release as discussed in
Section 3.4.
Figure 5d shows the Si-Si bond fraction increases with the simulation time and temperature. At 1500 K, there is a slight Si-Si bond fraction increase from 0 to 0.035. With the simulation temperature increase to 1800 K, the Si-Si bond fraction significantly increases from 0 to 0.19. At 2100 K simulation temperature, the Si-Si bond fraction increases from 0 to 0.21 and then stabilizes at 0.21. The results in
Figure 5d are consistent with the Si-O bond changes in
Figure 5a. Higher pyrolysis temperature and longer pyrolysis time lead to more Si-Si bonding to stabilize the pyrolyzing system. Again, this is the first simulation study that has quantified the bond content changing trend with the pyrolysis temperature. It is consistent with our earlier radial distribution function study that reported the Si-Si bond presence along with the C-C bonds [
27].
3.3. Polymer Structure Effect on SiOC Cluster and C Domain Formation
Bond fraction is a useful parameter to understand the overall bond changes. However, it cannot reveal specific atomic structure evolution. Thus, the understanding of the local atomic structure provided by the ReaxFF simulation can provide important insight in this regard. As shown in
Figure 1, among the five precursor systems studied, PDMS has the smallest side group, except for the -H side group in PHMS, which was used to adjust the C content of the PVMS and PMPS systems. All the bonds in the side group of PDMS are saturated. PVMS has a methyl group and a vinyl group (with a C double bond), which affects not only the C amount but also the bond strength between Si and C as well as between C atoms themselves. PDES has a fully saturated ethyl side group, which is different from the vinyl side group in PVMS considering the nature of the bonds between C atoms. PMPS has a methyl and a phenyl group, with the latter being bulky and difficult to escape from the pyrolyzing system. Because of these side group differences, their separation from the Si-O backbone is also different during pyrolysis. This leads to drastically different ceramic atomic evolution.
Since lower pyrolysis temperature leads to less atomic evolution, the atomic structures for the four precursor systems after 2100 K pyrolysis are given in
Figure 6. The 3D atomic structures for PDMS, PVMS, PDES, and PMPS systems at various simulation temperatures are given in the supplement (
Figures S10 and S11 for PVMS,
Figures S12–S14 for PDMS,
Figures S15–S17 for PDES, and
Figures S18 and S19 for PMPS).
Figure 6a shows that the PDMS system has a largely homogeneous SiOC structure. There is limited composition separation. Even in the Si-O rich clusters, C atoms are abundant. Many O atoms bond with C atoms. This means that the methyl side group in PDMS does not separate from the Si-O backbone easily. For PVMS (
Figure 6b), however, significant composition separation occurs. There are almost no C atoms that bond with Si. A smaller number of O atoms bond with C. The vinyl group experiences significant separation from the Si-O backbone during pyrolysis. This even causes the methyl group to separate from the Si-O backbone. For PDES (
Figure 6c), a large Si-O domain forms and separates from the C-rich regions. There are very few C atoms in such Si-O clusters. The more significant composition and cluster separation is consistent with the vinyl side group effect on PVMS. For PMPS (
Figure 6d), C forms many strands (graphitic C in 3D). The Si-O species are sparely dispersed in the C-rich regions. Limited O atoms are bonded to C atoms. This means that the phenyl group separates easily from the Si-O backbone and forms C clusters from its 6-C rings.
In general,
Figure 6 shows that fully saturated bonds from the C side groups and larger side groups lead to easier composition separation, as is the case for PDES and PMPS in this study. When the fully bonded C side group is small, Si-O strands cluster together and form a Si-O dominant structure. When the side group is large with a high C content (such as the phenyl group), C atoms cluster into large C domains and further evolve into graphitic C. A side group with saturated C bonds leads to easier composition separation than that with unsaturated C bonds (
Figure 6c for PDES vs.
Figure 6b for PVMS). The methyl group in
Figure 6a is the smallest, which leads to the most homogeneous composition distribution in SiOC. It also offers a higher probability for O atoms to bond with C atoms.
3.4. Gas Release Difference
Figure 7a shows the Si, O, and C composition changes for the PDMS precursor system at 2100 K. The Si and O contents are almost the same, with the atomic fraction increasing from 0.25 to 0.32. The overlapping curves for Si and O in
Figure 7a also mean that there is little O loss during the pyrolysis process since Si is not evaporative. However, the C content decreases significantly from 0.50 to 0.35 with the pyrolysis time increase from 0.5 ns to 2.0 ns, meaning that all the C loss has been through hydrocarbon or CO/CO
2 loss. This means that the methyl side group separation from the Si-O backbone is the dominant mechanism for the PDMS decomposition and SiOC formation.
Figure 7b shows the Si, O, and C content changes for the PVMS precursor system at 2100 K. The Si and O contents are almost the same, increasing from 0.22 to 0.26, until 1.5 ns holding time, then there is a Si content increase to 0.29 and an O content decrease to 0.25, indicating that the PVMS precursor starts to lose O during the pyrolysis process. There is also a steady C content decrease from 0.57 to 0.46 during the 2.0 ns pyrolysis time. The simultaneous C and O content decreases indicate CO/CO
2 gas formation and evaporation. Since the vinyl group is believed to separate from the Si-O backbone first [
27], which means that the methyl groups are being oxidized after their separation from the Si-O backbone starting at 1.5 ns. However, the overall C content decrease is not as high as for the PDMS system. This means that more C atoms are forming C-C domains.
Figure 7c shows the Si, O, and C content changes for the PDES precursor system at 2100 K. The simulation results show that the Si and O contents have the same changes, increasing from 0.17 to 0.34, indicating that there is little O loss during the pyrolysis process. The content increases are due to the C content decrease. Also, the Si and O content increase from 0.17 to 0.34 and the C content decrease from 0.67 to 0.31 occur simultaneously, in opposite directions. This means that most C atoms are lost through hydrocarbon loss and CO/CO
2 loss is negligible. The significant and early loss of C atoms also means that the ethyl group separates from the Si-O backbone easily.
Figure 7d shows the Si, O, and C content changes for the PMPS precursor system at 2100 K. The Si and O contents are almost the same until 1.0 ns pyrolysis time, increasing from 0.14 to 0.15, then there is a Si content increase and an O content decrease, indicating that it starts to lose O through CO/CO
2 during the pyrolysis process. Since the O loss occurs in the later stage of the holding time, the simulation results indicate that the C atoms from the methyl group are oxidized by O species. Considering that most of the C content in PMPS comes from the phenyl group, the overall C content is steady, at ~0.71. This means that most C atoms contribute to the formation of C-C domains.
Since the simulation systems have similar sizes (from 84,352 atoms to 102,912 atoms), the pyrolysis process can also be examined from the type and number of released gas molecules as a function of pyrolysis time.
Figure 8 shows the gas release results for the PDMS system at 2100 K. In the early stage of the pyrolysis, around 0.4 ns, CH
4 release is the most significant, followed by H
2 and then C
2H
6 and C
2H
4 [
42,
43]. The peak release is 638 molecules for CH
4, 203 molecules for H
2, 80 molecules for C
2H
6, and 23 molecules for C
2H
4 while the release of the other gas species is in the single digit or 0, as given in the table in
Figure 8a. This means that the methyl groups are released along with polymer condensation and re-bonding and formation of H
2, C
2H
6, and C
2H
4. This is correspondingly represented by the cumulative gas release results in
Figure 8b. The total release is 7293 molecules for CH
4, 2823 molecules for H
2, 694 molecules for C
2H
6, and 460 molecules for C
2H
4. The dominant gas species are CH
4 and H
2. There are little or no O-containing species such as CO, CO
2, O
2, or H
2O. C
6H
6 release is also almost none. Since the PDMS precursor has two methyl side groups in each repeating unit, the results indicate that the precursor decomposition is mainly through methyl group detachment and evolution. The total gas molecules released are 11,579.
For the PVMS system at 2100 K pyrolysis, the gas release process is spread out throughout the simulation instead of being concentrated in a certain stage (
Figure 9a). CH
4 and H
2 releases are still the most significant with 244 and 293 molecules, respectively, as the peak values around 0.35–0.39 ns. C
2H
2 loss is also significant at 192 molecules. This means that the methyl group detachment from the Si-O backbone is most likely, followed by polymer condensation and vinyl group detachment. However, the polymer decomposition is a sluggish process throughout the simulation. This is reflected not only in the prolonged process of gas release but also in the small numbers of removed gas molecules. Compared to the PDMS system, the difference is clear in the number of released CH
4 with only 38% of that from the PDMS pyrolysis at peak release time.
Figure 9b shows that CH
4 release is faster than other gasses in the early stage of the pyrolysis process. Then, H
2 gas release keeps increasing until it surpasses CH
4 release at ~1.5 ns. The overall CH
4 and H
2 release is much lower than that from the PDMS system. There is also increasing C
2H
2 and C
2H
4 removal. This means that the methyl group detachment happens first, followed by the vinyl group removal. After 1.35 ns simulation, there is an increase in CO gas release. This O loss is due to the disintegration of the Si-O backbone. Not surprisingly, there is a small amount of CO
2 and even some C
6H
6 molecules. Understandably, there is no loss of O
2. The total released gas molecules are 10,385, about 1200 less than that of the PDMS system.
At 2100 K pyrolysis temperature, PDES has the best-defined gas release behavior, with narrowly defined peaks for C
2H
4, H
2, C
2H
6, and C
2H
2 at 0.33 ns simulation time, the numbers of peak gas molecules released are 1697, 1116, 869, and 42 (
Figure 10a). This means that the ethyl groups are mostly removed as C
2H
4 and C
2H
6 and the polymer precursor molecules also condense to release a high number of H
2 molecules (1116). This also explains why PDES has the largest C loss in
Figure 7c. The cumulative gas release is also well defined with the gas release reaching the plateau values for C
2H
4, H
2, C
2H
6, and C
2H
2 at 6371, 4419, 3158, and 508 at ~0.75 ns (
Figure 10b). There is negligible release of H
2O, CH
4, CO, C
6H
6, CO
2, and O
2. This means that the ethyl group has a clean and consistent separation behavior from the Si-O backbone. Understandably, there is no CH
4 or C
6H
6 loss as the molecular structure has no methyl or phenyl group. Also, there is almost no O removal from the Si-O backbone. The total gas molecules lost are 14,636, the highest out of the four polymer precursor systems studied.
The gas release for the PMPS system at 2100 K has a bi-modal distribution as shown in
Figure 11a. At 0.3 ns, CH
4 reaches its peak gas release number of 243. At 1.12 ns, CO and H
2 reach the peak numbers of 464 and 444, respectively. These gas release curves are not well defined. Cumulatively, as shown in
Figure 11b, the total gas release is highest for H
2, at 4876 followed by CH
4 at 2074 molecules, CO at 1882 molecules, H
2O at 609 molecules, C
2H
2 at 546 molecules, and C
6H
6 at 238 molecules. The methyl group is likely removed as CH
4, with the polymer condensation leading to H
2 release. However, the phenyl group is well conserved and is believed to have converted into graphitic C. The total number of gasses released is 10,466, comparable to those of the PDMS and PVMS systems but much lower than that for the PDES system.
Overall, based on our simulation results, PDMS pyrolysis releases CH4 the most due to the presence of the only methyl functional group. PVMS releases CH4 the most followed by C2H2, thanks to the presence of both the methyl and vinyl groups. PDES releases C2H4 and C2H6, almost exclusively due to its ethyl group presence. PMPS releases CH4 because of the methyl group presence; the phenyl group is stable and converted to turbostratic C, remaining in the pyrolyzed ceramic. PMPS pyrolysis also leads to a large amount of CO and noticeable O2 releases. For the cumulative gas release, O2 counts at 0.06% of the total gas released. This means that the O2 species is negligible. It is either in transient states involved in bond re-formation or reduction process. We do not believe that O2 leaves the SiOC system as a gaseous product. The above behaviors are consistent with the polymer precursor molecular structure and functional group scission from the Si-O backbone. H2 is always released at a high amount for all the precursor systems due to polymer side group breakup and C-C bond redistribution. This simulation effort provides not only the exact sequence of the gas release but also the quantitative data of the released species for each given polymer precursor.