Wang, M.; Ma, S.; Jin, Y.; Wang, W.; Chen, J.; Hu, L.; He, S.
A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines 2021, 12, 169.
https://doi.org/10.3390/mi12020169
AMA Style
Wang M, Ma S, Jin Y, Wang W, Chen J, Hu L, He S.
A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines. 2021; 12(2):169.
https://doi.org/10.3390/mi12020169
Chicago/Turabian Style
Wang, Mengcheng, Shenglin Ma, Yufeng Jin, Wei Wang, Jing Chen, Liulin Hu, and Shuwei He.
2021. "A RF Redundant TSV Interconnection for High Resistance Si Interposer" Micromachines 12, no. 2: 169.
https://doi.org/10.3390/mi12020169
APA Style
Wang, M., Ma, S., Jin, Y., Wang, W., Chen, J., Hu, L., & He, S.
(2021). A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines, 12(2), 169.
https://doi.org/10.3390/mi12020169