Next Article in Journal
Physics-Based TCAD Simulation and Calibration of 600 V GaN/AlGaN/GaN Device Characteristics and Analysis of Interface Traps
Next Article in Special Issue
Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation
Previous Article in Journal
Cystic Fibrosis Human Organs-on-a-Chip
Previous Article in Special Issue
Study of the Absorption of Electromagnetic Radiation by 3D, Vacuum-Packaged, Nano-Machined CMOS Transistors for Uncooled IR Sensing
 
 

Order Article Reprints

Journal: Micromachines, 2021
Volume: 12
Number: 750

Article: Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments
Authors: by Jun-Hao Lee, Pin-Kuan Li, Hai-Wen Hung, Wallace Chuang, Eckart Schellkes, Kiyokazu Yasuda and Jenn-Ming Song
Link: https://www.mdpi.com/2072-666X/12/7/750

MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.

If you have any questions, or special requests, please write to our support team; we are happy to provide you with the information you need.

Reprint Options

If you need more than 400 copies, please contact us by e-mail (articlereprints@mdpi.com) and we will prepare an individual offer for you.

Order Cost and Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop