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Journal: Micromachines, 2022
Volume: 13
Number: 262

Article: Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique
Authors: by Man Li, Yufeng Guo, Jiafei Yao, Jun Zhang, Fanyu Liu and Weihua Tang
Link: https://www.mdpi.com/2072-666X/13/2/262

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