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Journal: Micromachines, 2022
Volume: 13
Number: 928
Article:
Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
Authors:
by
Jun Liu, Shanhong Xia, Chunrong Peng, Zhengwei Wu, Zhaozhi Chu, Zhouwei Zhang, Hucheng Lei, Fengjie Zheng and Wei Zhang
Link:
https://www.mdpi.com/2072-666X/13/6/928
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