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Journal: Micromachines, 2023
Volume: 14
Number: 1375

Article: ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding
Authors: by Renbin Huang, Daohua Zhan, Xiuding Yang, Bei Zhou, Linjun Tang, Nian Cai, Han Wang and Baojun Qiu
Link: https://www.mdpi.com/2072-666X/14/7/1375

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